RF & Microwave Industry News

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Quantum Leap Packaging Inc. (QLP), a provider of high performance, air cavity packages for semiconductor assembly, has announced the availability of HermeTech™, the industry's first hermetic plastic package that meets JEDEC standards. QLP is manufacturing HermeTech plastic air cavity QFNs that maintain hermetic leak rates of less than 5x10-8...

Fujitsu Ltd. (Fujitsu), Fujitsu Microelectronics of America Inc. (FMA) and Jazz Semiconductor (Jazz), a wholly owned subsidiary of Jazz Technologies Inc., announced that they will work together to manufacture System-on-Chip (SoC) products for RF CMOS devices. Under a Memorandum of Understanding (MoU) signed by the companies, the collaboration is...

Since Farran Technology was acquired by the Smiths Group there have been many positive changes. Farran has now been aligned with other similarly branded businesses, focused on markets within the Microwave Systems section of the Interconnect division, under the umbrella of the Specialty Engineering Group. With these changes in...

Eagle Comtronics is pleased to present four new products at this year’s IEEE MTT-S show. The product represents a portion of the product range presently offered by Eagle. SBLP Series – Switched Filter Assembly Filters Eagle Comtronics is extending its support of SONET/SDH customers by offering model SBLP-2-SP-SF/SF-X five...

Jazz Semiconductor announces the release of a new 130nm SiGe BiCMOS technology designed for high speed wireless and optical communications applications. This process combines industry standard 130nm CMOS with 200 GHz HBT NPN transistors for high performance RF and millimeter-wave integrated circuits. The technology offering includes advanced analog components...

P1dB announces YouForm™ high quality, low cost jacketed hand formable cables that feature stainless steel SMA plugs on each end and are now available in straight and right angle configurations. 100 percent VSWR tested 1.35:1 at 18 GHz for SMA straight connectors and 1.35:1 at 10 GHz for SMA...

On 22 May Ministers in charge of space activities in the Member States of the European Space Agency (ESA), and those tasked with internal market, industry and research within the European Union’s Competitiveness Council, met in Brussels, Belgium, to adopt a Resolution on the European Space Policy (ESP). Jointly...

Alcatel-Lucent has signed a $120 M agreement for mobile communications solutions and service with China Unicom, a Chinese mobile service provider. The agreement encompasses a range of network projects the service provider has undertaken or plans to undertake in 2007. The projects include a CDMA2000 1xEV-DO Rev. A high-speed...

The SAES® Getters Group and STMicroelectronics have signed a co-operation agreement that will support development and production of next generation MEMS gyroscopes. STMicroelectronics’ gyroscopes will integrate SAES’ PageWafer®, the most advanced getter thin-film solution for high vacuum maintenance in wafer-level packaged MEMS, to deliver higher device sensitivity and stability....

Over the years that we have been participating, the MTT-S has become an extremely important event for Pascall Electronics Ltd. and not just as a showcase for our products and expertise. Just as important, it has become a meeting place for our reps and agents along with our many...