We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
NXP Semiconductors announced that its continued strategic collaboration with geo to leverage geo's deep experience in energy management and NXP's intelligent system solutions for Matter.
Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm® Cortex® A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications.
AMD expanded of the AMD Versal™ adaptive system-on-chip (SoC) portfolio with the introduction of the Versal RF Series that includes the industry’s highest compute performance in a single-chip device with integrated direct RF-sampling data converters.
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide-free and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Remcom announced the integration of XFdtd® 3D Electromagnetic Simulation Software with Wireless InSite® 3D Wireless Propagation Software through a new Huygens surface capability.
Arctic Instruments has raised EUR 2.35 million in funding for the research, development and commercialisation of its superconducting microwave amplifier technology.
Global electronic test and measurement equipment specialist Electro Rent has appointed Alan Mayer as its chief revenue officer to spearhead the company’s growth plans.
DARPA has awarded BAE Systems’ FAST Labs™ research and development organization a $12 million contract as part of the High Operational Temperature Sensors (HOTS) program.
RSS
