RF & Microwave Industry News

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ETS-Lindgren and Rohde & Schwarz continue their long-standing partnership to deliver comprehensive OTA testing solutions for next-generation wireless technologies.

The SATELLITE Conference and Exhibition announced the competitors and judges for the 9th annual Startup Space entrepreneur pitch competition. 

Qualcomm Incorporated announced the appointment of Dr. Baaziz Achour to the role of chief technology officer (CTO), Qualcomm Technologies, Inc., and the retirement of Dr. James Thompson, each effective February 3, 2025.

Mercury Systems, Inc. introduced a system on module (SoM) and 3U SOSA-aligned OpenVPX board powered by Altera’s™ most advanced Agilex 9 Direct RF FPGA chips.

With its new R&S NRPxE RF power sensors, Rohde & Schwarz sets a new standard for accurate and reliable power measurements in frequency ranges up to 18 GHz.

NXP Semiconductors  announced that its continued strategic collaboration with geo to  leverage geo's deep experience in energy management and NXP's intelligent system solutions for Matter.

Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm® Cortex® A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications.

5G Americas has released a groundbreaking white paper titled, “Artificial Intelligence in Cellular Networks.” 

AMD expanded of the AMD Versal™ adaptive system-on-chip (SoC) portfolio with the introduction of the Versal RF Series that includes the industry’s highest compute performance in a single-chip device with integrated direct RF-sampling data converters.