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Akoustis Technologies, Inc. announced that it has completed qualification and released its internally developed proprietary wafer-level-packaging (WLP) technology for the 5G mobile, Wi-Fi, timing control and other markets.
Indium Corporation® has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.
During CES 2023, Ansys will showcase how its comprehensive simulation solutions are accelerating a connected, autonomous, shared and electric future for the mobility industry.
At CES 2023 in Las Vegas, Rohde & Schwarz will present the R&S ATS1500C radar test chamber—a complete test solution for interference and RF performance testing of automotive radar sensors, the primary technology that enables autonomous driving.
Stability Wafer™ on-wafer probing cable assemblies from Maury Microwave provide table and repeatable electrical performance and are flexible to facilitate easy installation.
Times Microwave Systems has launched a brand-new, completely redesigned website configured to provide user-friendly education across the wide range of industries where the company’s technology, expertise and products are used.
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