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In addition to smaller case size 01005BB and the 0201BB broadband capacitors, Passive Plus, Inc. (PPI) has developed larger broadband capacitors in three larger case sizes: 0402BB, 0603BB and 0805BB.
Telecom Infra Project (TIP) is collaborating with Intel and Analog Devices to enable the metaverse with O-RAN mMIMO solutions, as part of the TIP OpenRAN project group.
Jetted Additively Manufactured Electronics Sources (J.A.M.E.S) announced the giveaway of the CST Studio Suite for electromagnetic and electronics simulation.
Amphenol RF announced the expansion of its 12G product portfolio to include pre-configured HD-BNC cable assemblies featuring panel mount jack connectors on the Belden 4855R cable type.
Synopsys, Inc., Ansys and Keysight Technologies, Inc. announced the availability of their new mmWave RF design flow for TSMC's 16 nm FinFET Compact technology.
Akoustis Technologies, Inc. announced that it has received three new Wi-Fi 6E design wins for carrier-class applications, two design wins are for a leading European carrier-class Wi-Fi OEM and the third is for a global network communication solutions provider.
According to global technology intelligence firm ABI Research, by 2030, the installed base of smart poles will exceed 10.8 million globally with system revenues amounting to US$60 billion.
ThinKom Solutions, Inc. announced its flagship ThinAir® Ku3030 antenna—branded as 2Ku by Intelsat—has logged more than 30 million hours of operational time on commercial aircraft.
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