RF & Microwave Industry News

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A new briefing paper from 5G Americas details the dynamic trajectory of 5G devices, from ubiquitous smartphones to pioneering RedCap and battery-less ambient IoT devices, highlighting the versatile future of 5G technology.

Richardson RFPD, Inc. announced the availability and full design support capabilities for a new RF front-end module from United Monolithic Semiconductors.

Infineon Technologies AG announced the company is extending its AIROC™ portfolio with the AIROC CYW5551x Wi-Fi 6/6E and Bluetooth® 5.4 solution. 

The future of our industry depends on the interest that this generation of RF engineering and manufacturing professionals can create to inspire the next generation of RF engineering and manufacturing professionals. Read this for some great thoughts about the opportunities to aid in this process. 

Pasternack announced its cutting-edge lineup of MIL-STD-1553 products tailored for today's high performance data bus systems: dust caps, terminators and adapters.

CAES has been awarded a contract from the U.S. Navy for production of the AN/ALQ-99 Low Band Consolidation (LBC) transmitter. 

Huawei, in cooperation with startup company PROBOTEK, launched its early fire detection use case in Cyprus' capital Nicosia. 

Infineon Technologies AG announced the closing of the acquisition of GaN Systems Inc. 

The 2024 IEEE VLSI Symposium on Technology & Circuits has announced a call for papers around the theme: “Bridging the Digital & Physical Words with Efficiency & Intelligence.”