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Raytheon has been awarded a $20 million contract through the S2MARTS consortium to develop a next-generation multi-chip package for use in ground, maritime and airborne sensors.
Mercury Systems, Inc. announced it signed a three-year subcontract worth as much as $96 million with Raytheon, an RTX business, to deliver high performance signal processing sub-systems for the U.S. Army’s LTAMDS.
OWT Global and Echodyne Corp. announced a strategic relationship to develop and bring to market next-generation situational awareness solutions across OWT Global’s portfolio.
Smiths Interconnect announced the launch of a new temperature variable attenuator selector, which can automatically generate the overall performance of the selected Thermopad® product.
Keysight Technologies, Inc. has extended the number of its test cases available for the Skylo Technologies non-terrestrial network (NTN) certification program to 21.
Amphenol Corporation announced a definitive agreement to acquire the Carlisle Interconnect Technologies (CIT) business of Carlisle Companies Incorporated for $2.025 billion in cash, subject to customary post-closing adjustments.
Sivers Semiconductors AB announced the expansion of its chipset agreement with Thorium Space, focusing on the advanced development and validation of the chipsets designed in the initial phase, further laying the groundwork for future large-scale manufacturing.
Gel-Pak launched of its Gel-Probe products, featuring enhanced probe tip cleaning and polishing solutions designed for semiconductor test applications.
Reticulate Micro, Inc. has announced the formation of Reticulate Space, its new business segment focused on bringing to market breakthrough multi-orbit satellite communications management technologies for government and commercial users.
At the recent O-RAN ALLIANCE Global PlugFest Fall 2023, Rohde & Schwarz and VIAVI Solutions presented their integrated solution for automated conformance testing of O-RAN radio units.
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