RF & Microwave Industry News

Hesse & Knipps Demonstrate Bonder

Hesse & Knipps GmbH Semiconductor Equipment , a manufacturer of high speed fine pitch wedge bonders for the backend semiconductor industry, announced that it will be demonstrating its BONDJET BJ820 fully automatic thin wire bonder at the 2007 International Microwave Symposium (IMS). The demonstration will take place in booth...
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