RF & Microwave Industry News

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The Rohde & Schwarz Oscilloscope Days event is scheduled for April 18 and 19 and will present a series of webinars to address challenges engineers face in a range of measurement applications.

Infineon Technologies AG and Delta Electronics, Inc. signed a Memorandum of Understanding to provide more efficient and higher-density solutions for the fast-growing market of electric vehicles.

For the first time, scientists at the University of Sydney and the University of Basel in Switzerland have demonstrated the ability to manipulate and identify small numbers of interacting photons – packets of light energy – with high correlation.

Rohde & Schwarz has announced the U.K. dates and venues for the in-person Demystifying EMC Global Tour for April 25 in Reading and April 27 in Leeds. 

ALL.SPACE announced the delivery of its first smart terminal to SES for testing over its medium earth orbit systems, O3b and O3b mPOWER. 

Massachusetts Institute of Technology (MIT) researchers have developed a circuit architecture that targets and blocks unwanted signals at a receiver’s input without hurting its performance.

InstaBend 141 provides a larger-diameter, lower loss addition to Times Microwave’s Systems InstaBend family of microwave assemblies, which feature a flexible preassembled design for interconnects between RF circuit cards, modules and enclosure panels. 

Nano Dimension Ltd. announced that it has inaugurated its new European headquarters in Munich, Germany, to further its commercial and research and development (R&D) efforts.