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According to a study published in Nature, an international team of researchers from Rice University and Hanyang University developed a new material by embedding clusters of highly dielectric ceramic nanoparticles into an elastic polymer.
Celestia TTi's new generation of GaN solid-state power amplifiers (SSPAs) in DBS can deliver up to 54.8 dBm/57.4 dBm/52 dBm at P LINEAR from a highly compact footprint.
To continue to provide critical infrastructure operators with a secure timing solution, Microchip Technology announces the release of version 2.4 of the TimeProvider® 4100 grandmaster firmware with an embedded BlueSky™ firewall function to detect potential threats and validate GNSS before using the signal as a time reference.
IDTechEx’s report, “Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets,” delves into key considerations such as antenna element choice, substrate technology, integration of passive devices and supply chain maturity.
KRYTAR, Inc. announces a new MLDD 2-way power divider offering excellent performance over the frequency range of 0.4 to 7.125 GHz (L- through C-Bands) in a compact package.
Arctic Semiconductor announced that its low power, high performance 4x4 transceiver IceWings is powering a new small cell platform that has passed 3GPP specification and will soon be available in mass production.
The U.S. Army awarded Lockheed Martin a $756 million contract to deliver additional capability for the nation’s ground-based hypersonic weapon system, the Long Range Hypersonic Weapon (LRHW).
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