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Qualcomm Incorporated announced the appointment of Dr. Baaziz Achour to the role of chief technology officer (CTO), Qualcomm Technologies, Inc., and the retirement of Dr. James Thompson, each effective February 3, 2025.
Mercury Systems, Inc. introduced a system on module (SoM) and 3U SOSA-aligned OpenVPX board powered by Altera’s™ most advanced Agilex 9 Direct RF FPGA chips.
With its new R&S NRPxE RF power sensors, Rohde & Schwarz sets a new standard for accurate and reliable power measurements in frequency ranges up to 18 GHz.
NXP Semiconductors announced that its continued strategic collaboration with geo to leverage geo's deep experience in energy management and NXP's intelligent system solutions for Matter.
Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm® Cortex® A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications.
AMD expanded of the AMD Versal™ adaptive system-on-chip (SoC) portfolio with the introduction of the Versal RF Series that includes the industry’s highest compute performance in a single-chip device with integrated direct RF-sampling data converters.
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide-free and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
TTM Technologies has expanded its RF and Specialty Components product offering by releasing a family of components supporting telecom band n104, an emerging band extension for 5.5G applications.
Remcom announced the integration of XFdtd® 3D Electromagnetic Simulation Software with Wireless InSite® 3D Wireless Propagation Software through a new Huygens surface capability.
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