Intel, a world leader in computing innovation, and Wipro Limited, a leading global information technology, consulting, and business process services company, announced that they are joining the International M2M Council (IMC), a global trade association for the growing industry known as the Internet of Things (or machine-to-machine communications). IMC, which has quickly gained over 10,000 members, comprised almost entirely of OEMs, enterprise users, and applications developers, aims to boost understanding and sales in IoT.
The SX probe heads' high measurement resolution allows the developer to pinpoint RF sources of between 1 and 10 GHz on densely packed printed circuit boards or on IC pins. The handy compact pin shape of the EMC near-field probes from Langer EMV-Technik GmbH provides the developer with convenient working conditions on the respective PCB.
Cirexx International announced that they will be presenting their ECLIPS technology at IMS2015 in Phoenix, Ariz., May 17-22. Cirexx will be in Booth # 2023. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave printed circuit boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.
Visit Intercept Technololgy at IMS2015, May 17-22 at Booth # 948 for a look at the company's ADS Board Link interface. It uses Keysight's ABL format to import schematic and layout information, in tandem with a library of ADS models in Intercept format.