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Indium Corporation® will introduce NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC), May 31 to June 3, San Diego, Calif.
Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at the International Microwave Symposium, Denver, Colo., June 19–24.
Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser, SD1.
Indium Corporation and Valuetronics International have formed a strategic partnership to serve customers in the Americas with its cored wire, rework fluxes and bar solder products.
Indium Corporation has expanded its portfolio of precision preforms with an ultra-thin AuSn preform designed for semiconductor laser applications, where thermal management has become a challenge.