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The Global Certification Forum (GCF) and Telecommunications Technology Association (TTA) announced the activation of oneM2M Release 2 within GCF’s certification programme for oneM2M. Release 2 extends the scope of the oneM2M standard to meet the needs of the global IoT market.
CES 2023 marks KYOCERA AVX’s first year of participation at this legendary industry event, which will consist of a main exhibition at booth #11123, a co-exhibit at the KYOCERA SLD Laser booth (#7075) and a panel discussion in partnership with the IMC IoT M2M Council.
Adding to NXP’s expanding portfolio of end-to-end Matter solutions, the RW612 and the K32W148 devices combine advanced edge processing capabilities with integrated security to streamline development, simplify designs and reduce costs for Matter-enabled smart home devices.
Sony Semiconductor Israel announced the launch of the ALT1350, a cellular LTE-M/NB-IoT solution to enable additional LPWA communication protocols in a single chipset.
Skyworks Solutions, Inc. and Sequans Communications S.A. introduced the SKY66431, a 5G massive IoT SiP solution, which combines Sequans’ Monarch 2 modem with Skyworks’ industry-leading RF front-end solution.
Renesas is expanding its low-power WAN product line as part of its strategy to deliver connectivity devices used for smart cities, smart homes, medical devices and industrial applications.
Renesas Electronics Corporation unveiled plans to deliver a comprehensive set of advanced Wi-Fi offerings to complement its broad portfolio of industrial and IoT products with its acquisition of Celeno.
Rockwell Automation collaborated with Ericsson and Qualcomm Technologies, Inc. and evaluated industrial Private 5G technology with EtherNet/IP™ connectivity.
To support hardware and software engineers in the development of IoT devices, Infineon Technologies AG has launched the XENSIV™ connected sensor kit (CSK), a new IoT sensor platform for rapid prototyping and development of customized IoT solutions.
