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Small Cell Forum (SCF), the telecoms organization driving universal cellular coverage, today announced the results of an in-depth survey of over 50 mobile operators, undertaken by Rethink Technology Research. The survey questioned operators’ deployment plans and business drivers for a dense HetNet, as well as the barriers they expect to have to overcome.
Leonardo and Microsoft will collaborate on an Industry 4.0 solution to provide the manufacturing sector with a new tool to enable complete and integrated control.
u-blox has achieved certification of its SARA-R404M module for Verizon’s nationwide Category M1 LTE network, which will support industrial Internet of Things applications.
Huawei and Altair have signed a Memorandum of Understanding and will cooperate with each other to develop industrial simulation cloud solutions for their customers.
“The RF front end modules and components market for cellphones is highly dynamic”, asserts Claire Troadec, Activity Leader, RF Devices & Technologies at Yole Développement (Yole). And she adds:” From being worth US$10.1billion last year, it is expected to reach U$22.7 billion in 2022.” Such high growth is definitely something that players in other semiconductor markets would envy: a market that will more than double in six years! However, the growth is not evenly distributed…
Mentor Graphics Corp. announced the launch of the Open Manufacturing Language (OML) initiative that directly addresses the longstanding need and urgent calls from the industry for a printed circuit board (PCB) assembly-specific Internet of Manufacturing solution. For the first time, IT teams, solution providers, and equipment providers can easily integrate shop-floor data to create or enhance added-value manufacturing execution solutions based on a single, normalized, vendor-neutral communication interface.
Infineon Technologies has opened a new building complex in Villach, Austria for production, research and development where the focus is on designing the development and production environment according to the principles of Industry 4.0.
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, announced William M. Holt, executive vice president and general manager of the Technology and Manufacturing Group (TMG) at Intel, has been named the 2015 recipient of SIA’s highest honor, the Robert N. Noyce Award. SIA presents the Noyce Award annually in recognition of a leader who has made outstanding contributions to the U.S. semiconductor industry in technology or public policy. Holt will accept the award at SIA’s Annual Award Dinner on Thursday, Dec. 3.
Mercury Systems, Inc., will join an elite group of defense industry leaders at Defense Innovation Days, Aug. 26-28, 2015, in Newport, R.I. Presented by the Southeastern New England Defense Industry Alliance (SENEDIA), the conference unites organizations developing cutting-edge technology and policymakers helping steer the nation’s defense strategy.
UMS has introduced a state of the art fully integrated 24 GHz transceiver solution for industrial sensor and car radar applications.
Infineon Technologies has opened a new building complex in Villach, Austria for production, research and development where the focus is on designing the development and production environment according to the principles of Industry 4.0.