Mission Microwave Technologies Inc., a manufacturer of compact, highly efficient solid state power amplifiers and block up-converters, announced that they have been selected through the U.S. Air Force SBIR Program for a Phase II contract to develop highly efficient and linear highpower Ka-Band solid state power amplifiers (SSPAs). The award is under SBIR program topic (AF151-150) for “Ka-Band Efficient, Linear Power Amplifiers for SATCOM Ground Terminals,” and aims to deliver greater than 70 W of linear RF power over 30 to 31 GHz, with efficiencies in excess of 35 percent.
Millitech, a microwave brand of Smiths Interconnect, announced the release of a new gallium nitride (GaN) based power amplifiers with exceptional output power and power-added efficiency (PAE) at E-Band and W-Band. Offering up to 2.5 W of output power and up to 20% PAE, typical gain figures range from 15 to 40 dB. 
The Institute of Electrical and Electronics Engineers (IEEE) Wireless and Microwave Technology Conference (
To address the need for radio systems that can adapt to changing environments on the fly and that can be easily reconfigured once in the field, BAE Systems has developed the MATRICS (Microwave Array Technology for Reconfigurable Integrated Circuits) chip.
Pickering Interfaces will showcase their broad range of PXI and LXI RF & Microwave switching solutions, along with their soon-to-be-released 2-slot USB/LXI Modular Chassis and LXI Simulation Tool at EDI CON USA 2016, Booth 822 taking place September 20-22 in Boston, Mass.
Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter wave devices, announces the availability of new Microwave Global Models™ for Passive Plus 0505C and 1111C surface mount chip capacitor families. 
EDI CON USA 2016 is pleased to announce that James Komiak, Ph.D., renowned amplifier expert and Global Engineering/Scientific Fellow at BAE Systems, will be kicking off the conference’s amplifier track on Tuesday September 20 at 9:30 a.m. with a keynote talk. Taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, the EDI CON USA conference and exhibition brings together engineers working on high-frequency analog and high-speed digital designs for learning and networking opportunities.