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Vishay Intertechnology, Inc. introduced a new series of AEC-Q200 qualified thin film chip resistors that provide high frequency performance up to 70 GHz for automotive, space, avionics, telecom and military applications.
At IMS 2024, Rohde & Schwarz will present a demonstration of the characterization of the TX/RX multi-antenna chip (CHARM) operating at up to 140 GHz using the D-Band OTA test solution.
EdgeQ Inc has raised $75 million to help fund a ramp up in production as the company starts selling its technology to customers, including telecom operators.
Massachusetts Institute of Technology (MIT) researchers have developed a circuit architecture that targets and blocks unwanted signals at a receiver’s input without hurting its performance.
General Motors Co. (GM) and GlobalFoundries (GF) announced a strategic, long-term agreement establishing a dedicated capacity corridor exclusively for GM’s chip supply.
Arbe Robotics announced the launch of the final RF chipset production configuration, which increases range, reduces power consumption and offers the industry-first combination of design flexibility with ultra-high-resolution.
Mercury Systems Inc. announced it received a $14 million order from a leading defense prime contractor to provide system-in-package (SiP) assemblies for an airborne secure processing application.
To address the need for radio systems that can adapt to changing environments on the fly and that can be easily reconfigured once in the field, BAE Systems has developed the MATRICS (Microwave Array Technology for Reconfigurable Integrated Circuits) chip.
Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter wave devices, announces the availability of new Microwave Global Models™ for Passive Plus 0505C and 1111C surface mount chip capacitor families.