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Raytheon has been awarded a $344 million contract for the development of two missile variants – the SM-2 Block IIICU and SM-6 Block IU – which will be based on a common guidance section, where the electronics and software that guide a missile to its target are housed.
Nexar has announced the launch of Spectra, a suite of electronics industry data intelligence offerings and products to help businesses better anticipate supply chain challenges and opportunities and respond strategically to changing market conditions.
Sorin Fericean’s book is titled Inductive Sensors for Industrial Applications and primarily deals with sensors containing inductive primary sensing elements, and that is because the “Inductive” is one of most widely used in the market and also due to the fact that the author acted mainly in the R & D, manufacturing and tests and marketing fields for inductive sensors for more than 25 years.
Preetpaul Singh Devgan's book, Applications of Modern RF Photonics, presents applications of modern RF photonic systems that use RF photonic components for commonly used signal processing systems. In this post, he explains what he hopes readers get out of his book.
DuPont Electronics & Imaging and SCHMID Group announce that they have entered into a nonexclusive joint development agreement to explore new PCB plating applications to bring advanced innovations to our global customers. The partnership will benefit high-end printed circuit board manufacturers by delivering next-generation interconnect products and metallization processes that can create faster, smarter and more reliable devices for the 5G era. The new solutions which will include equipment and chemistry are expected to be launched in late 2020.
University of Glasgow engineers have scaled up the established processes for making flexible silicon chips to the size required for delivering high-performance bendable systems.
