Articles Tagged with ''circuit''

Auriga Microwave, an innovator in the design of high-powered RF and microwave devices, announces that the U.S. Patent and Trademark Office granted a patent for technology that will make the control circuit design much simpler for high-power RF switches used in many communication systems.

Piconics Inc. and Modelithics Inc. have collaborated to upgrade the previous Piconics conical inductor S-parameter models to full equivalent circuit models, now offering substrate scalability/selectability, series and shunt configurations, and broadband validation up to as high as 65 GHz for some configurations. These models represent the first comprehensive, measurement-based equivalent circuit models for conical inductors in the Modelithics Library.

VidaRF offers low cost Drop-In, 1”x1” Circulators & Isolators designed for various wireless and power amplifier applications. The robust design provides high performance and reliability, typ specs: VSWR 1.13/Loss 0.25dB/ISOL 23dB, great IMD, and is magnetically shielded. Circuit tab can be straight or bent flush with base for surface mounting.

Rogers Corp. will be showcasing its high performance circuit materials for commercial and military satellite communications (satcom) electronic applications at the upcoming Satellite 2013 Exhibition.

What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.

Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include  substrate scaling, pad geometry scaling and part value selectability.

AWR's new application note, “Using Analyst™ To Quickly And Accurately Optimize A Chip-Module-Board Transition,” highlights the unique features of its’s 3D finite element method (FEM) EM simulator by demonstrating the optimization of the transition from a board-to-chip signal path.

AWR has just published a new Microwave Office® software application note titled, “End-to-end Design and Realization of an X-band Transmission Analyzer Using AWR Circuit, System, and EM Software.” The note examines the complete flow and details the design of several critical design elements for this device, which integrates many RF components on a single printed circuit board (PCB).

Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.

Rogers Corp., a leading supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.