Articles Tagged with ''automotive''

NXP Semiconductors N.V., the world’s largest supplier of automotive semiconductors, announced a new automotive radar microcontroller (MCU), the NXP S32R27, that will deliver the features and performance required for making safe, automated driving a reality. NXP is the leading supplier of radar-based ADAS semiconductor solutions. An estimated 50 percent of all car radar modules shipped in 2016 will utilize NXP radar processing and front-end technology.

NXP Semiconductors and its partners showcased the progress of secure intelligent transport with live demonstrations of platooning on the roads of Munich.

This wireless BMS concept car, developed by Linear’s design partner LION Smart, combines Linear’s highly accurate battery stack monitors with its SmartMesh® wireless mesh networking products in a BMW i3, replacing the traditional wired connections between the battery packs and the battery management system.

The INNOposium, a Würth Elektronik and Texas Instruments forum for decision-makers in the electronics sector, has been held for the second time in Stuttgart, Germany.

The electronica trade fair will be held November 8-11, 2016, in Munich. Rohde & Schwarz will present its portfolio of T&M solutions tailored to the requirements of today's most significant technology trends (hall A1, booth 307).

Autotech Council Member Anritsu Co. (booth #9046) will showcase its industry-leading test solutions that efficiently and accurately verify connected car designs at the Automotive Test Expo, to be held October 25-27, Novi, Michigan. In addition to product demonstrations, Anritsu is also an Open Technology Forum participant and will present a roadmap on LTE and how to test connected car systems using wireless technology, highlighting the global test company’s leadership position in the new generation of automotive designs.

The hot topics of electric vehicles and the evolution to 5G will be the specific focus for Knowles Capacitors as the company highlights new products at Electronica 2016.

AUDI AG, BMW Group, Daimler AG, Ericsson, Huawei, Intel, Nokia and Qualcomm Inc., announce the formation of the “5G Automotive Association”. The association will develop, test and promote communications solutions, support standardization and accelerate commercial availability and global market penetration. The goal is to address society’s connected mobility and road safety needs with applications such as connected automated driving, ubiquitous access to services and integration into smart cities and intelligent transportation.

Rosenberger has launched what it claims to be the next generation of automotive coax connectors for high data transmissions up to 15 GHz/20 Gbps.

Rohde & Schwarz follows the call to London to attend European Microwave Week, where the company will demonstrate its T&M highlights for demanding applications in the aerospace & defense, automotive and wireless industries. In focus: test solutions for satellite communications, for radar applications in the A&D and automotive sectors and for the next generation of mobile networks 5G.