Articles Tagged with ''automotive''

"For the automotive industry the emergence of the IoT constitutes a disruptive and transformative environment characterized by value chain and business model upheaval and a ‘collaborate or die’ ecosystem friction reality prompting it to redefine and reinvent itself in order to capitalize on the huge opportunities in the new IoT economy. The absorption of the automotive industry in the wider IoT is driven by new connected car use cases such as EVs as a mobile grid and vehicles used as delivery locations. As this IoT revolution unfolds, automotive innovation and value creation will be shifting to the boundaries with other verticals such as home automation, smart grids, smart cities, healthcare and retail,” says ABI Research VP and practice director Dominique Bonte. 

NXP Semiconductors announced that the TEF510x, the second product from the RoadLINK™ range, is now available to automotive OEMs and Tier 1 suppliers for design-in.

At the international Automotive Testing Expo 2014 in Stuttgart Rohde & Schwarz will exhibit its test solutions for wireless applications such as vehicular radar, intelligent transport systems, eCall and automotive Ethernet interfaces.

STMicroelectronics and Changan Automobile have set up Changan – ST Automotive Electronic Joint Laboratory to extend the cooperation of the two companies in automotive electronics.

Aeris Communications, the Made for Machines™ technology and service provider, announced the addition of Michelle Avary as the vice president, business development-automotive. Avary brings more than 15 years of experience to the role, serving most recently as the Director, Technology Strategy for Harman International. Previously, she worked for Toyota for more than a decade where she led and developed strategies for its telematics products and services.

Agilent Technologies Inc. announced it will show its newest wireless design and test solutions that address present and future test technology challenges in  LTE, LTE-A, and 3GPP, Releases 11 and 12, at Mobile World Congress, Feb. 24-27, Barcelona, Spain.

Coilcraft’s XAL1010 Series of high-temperature, shielded power inductors combines excellent current handling and exceptionally low DC resistance in a rugged, molded package.

Altium Ltd. released a new range of PCB component libraries for Altium Designer supporting a wide range of Rosenberger’s board-mount connectors.

Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Jiro Hashizume recently joined the company to head up its new subsidiary, Hesse Mechatronics Japan Co. Ltd.

The new AT549RBT cored-spring inductor from Coilcraft CPS (Critical Products & Services) features a temperature rating of -55° to +300°C, making it ideal for extreme-temperature applications such as down-hole drilling and on-engine automotive.