Articles Tagged with ''designcon''

Anritsu Co. (booth #717) will highlight its leadership position in high-speed digital test – displaying the industry’s only solution that supports 112G PAM4 generation and BER tests with accurate jitter injection – at DesignCon 2016. The new solution, which features the award-winning MP1800A BERT Signal Quality Analyzer (SQA) and new 64G baud 2-bit DAC with MUX, is part of a portfolio of test solutions and technologies that Anritsu will showcase to help engineers verify high-speed chip, board, and system designs used for emerging networks.

Anritsu Co. and DVT Solutions will demonstrate an integrated test solution that can conduct high-quality S-parameter measurements as well as time domain analysis on high-speed printed circuit boards (PCBs), packages and backplanes in the Anritsu DesignCon 2016 booth (#717). 

Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.

Global connectivity supplier HUBER+SUHNER unveils its new high speed digital testing solutions at DesignCon 2015. The company has chosen the Santa Clara event for the global launch of its MPX50 precision multicoax connector solution which combines the highest density, lowest loss and highest performance characteristics for cutting edge data rate testing in one testing solution.

ARC Technologies is showcasing its wide range of capabilities to solve microwave and RF interference, radar absorbing, and EMI control challenges at 2015 DesignCon  in Santa Clara, Calif.

Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at DesignCon January 28-29, 2015 at the Santa Clara Convention Center in Santa Clara, Calif.

UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, held its annual DesignCon conference and expo last week in Santa Clara, CA.  Met with enthusiastic industry reception, DesignCon 2014 was attended by more than 5,000 members of the chip, package, board and systems design communities.

Anritsu Co. (DesignCon booth #501), a world leader in high-speed signal integrity test solutions, will present a series of technical and educational sessions during DesignCon to help engineers solve the measurement challenges associated with designing high-speed semiconductors, and communications systems and devices. Additionally, technical demonstrations will be held in the Anritsu booth throughout DesignCon, which is scheduled for January 28-31 in the Santa Clara Convention Center, Santa Clara, CA.

UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, will welcome thousands of influential members of the chip, package and board design communities to DesignCon 2014, January 28 – 31, at the Santa Clara Convention Center in Santa Clara, California. Recognized as the premier annual trade event and technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design, DesignCon will host Keynote Speakers from Intel, Micron Technologies and XPRIZE.