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Timed for the now-cancelled Mobile World Congress, Qualcomm Technologies announced its third-generation 5G modem-to-antenna solution, the Snapdragon X60. Samples will ship this quarter, which will support the commercial release of smartphones in early 2021.
Pasternack, an Infinite Electronics brand, has introduced a new product line of coaxial packaged tunnel diode detectors that are in-stock and available with no MOQ required.
Coilcraft's new SLR Family of high current, shielded power inductors is offered with current ratings up to 100 amps and inductance values from 85 to 370 nH, making it suitable for high frequency applications such as multi-phase VRM/VRD/EVRD regulators, Intel™ IMVP compatible systems, and GPUs/video graphic cards. The inductors also feature a tight DCR tolerance (±5.4% to ±10%) for lossless, inductor DCR-based current sensing.
Ericsson has announced it will join AT&T and chipset provider Altair to demonstrate LTE Power Saving Mode on commercial LTE Internet of Things (IoT) chipset platform at the GSMA Mobile 360 Series - North America event on October 27-29 in Atlanta, Georgia. The demonstration will be held in the AT&T booth running on Ericsson networks and Altair’s FourGee-1160 Cat 1 chipset featuring ultra-low power consumption.
NI (formerly AWR Corp.) announces that NI AWR Design Environment™ V12 will be showcased in a full slate of events at the International IEEE Conference on Microwaves, Communications, Antennas and Electronic Systems (IEEE COMCAS 2015), which will be held in Tel Aviv, Israel, November 2-4, 2015.
Analog Devices Inc. introduced a high-performance clock jitter attenuator designed to support the JESD204B serial interface standard for connecting high-speed data converters and field-programmable gate arrays (FPGAs) operating in base station designs.
HYPERLABS has added S-parameter capabilities (S11, S21) to Version 2.0 of its XTDR™ software. These features complement the existing time domain features (TDR, TDT, NEXT, and FEXT) already found in the HL2200 and HL5200 Series Signal Path Analyzers.
DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, announced the release of the most advanced version of Sherlock Automated Design Analysis™ software, version 4.0. The newest version of Sherlock allows users to model complex PCBs and components with exceptional detail, strengthening design decisions, saving significant time and money.
TDK Corp. announces the new EPCOS duplexer for LTE Band 1, which at 60 dB features very high isolation for both the Tx and Rx paths. Based on SAW technology, the B8651duplexer has a miniature footprint of just 1.8 mm x 1.4 mm.
Vishay Precision Group Inc. announced that its Vishay Foil Resistors brand (VFR) has introduced a new Bulk Metal® Foil RTD Simulator resistor with built-in climate control. Designed to simulate resistance temperature detector (RTD) PT-100 and PT-1000 outputs for the calibration of RTD instruments, the device features a low nominal TCR of ±1 ppm/°C from -55°C to +125°C, +25°C ref., and load-life stability of ±0.005% after 2,000 hours of rated power at +70°C.
Coilcraft's new SLR Family of high current, shielded power inductors is offered with current ratings up to 100 amps and inductance values from 85 to 370 nH, making it suitable for high frequency applications such as multi-phase VRM/VRD/EVRD regulators, Intel™ IMVP compatible systems, and GPUs/video graphic cards. The inductors also feature a tight DCR tolerance (±5.4% to ±10%) for lossless, inductor DCR-based current sensing.
HYPERLABS has added S-parameter capabilities (S11, S21) to Version 2.0 of its XTDR™ software. These features complement the existing time domain features (TDR, TDT, NEXT, and FEXT) already found in the HL2200 and HL5200 Series Signal Path Analyzers.