Articles Tagged with ''passive''

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.

ABI Research expects the market for in-building wireless equipment and deployments to grow to over $8 billion in 2019, up from a forecast $4.4 billion for 2014 representing a 14% compound annual growth rate (CAGR).

As the ability to provide consistent wireless coverage and capacity to support uninterrupted wireless services indoors is critical for operators, Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, is continuing to enhance its portfolio of products to support wireless in-building solutions. As part of this ongoing focus to enable operators to seamlessly bring the network inside the buildings where service is demanded, RFS announced the release of its I-ATO3-698/2700 Series of plenum-rated, PIM-certified omni-directional antennas.

Passive Plus Inc. now offers an extended-values for the traditional Hi-Q high power, low ESR/ESL, low noise, high self-resonance ultra-stable performance capacitors. Usually used for wireless broadcasting equipment, mobile base stations, GPS portables, MRI coils and radar, these capacitors are 100 percent RoHS and offered in magnetic and non-magnetic terminations. These capacitors are designed and manufactured to meet the requirements for MIL-PRF-55681 and MIL-PRF-123.

AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, is showcasing its full range of MLO™ diplexers at the European Microwave Week Exhibition. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups. 

Pulse Electronics Corp., a leading provider of electronic components, now announces in-house capability to integrate passive surface mount technology (SMT) components on 3D laser direct structuring (LDS) antennas. Incorporating SMT components with the 3D LDS antenna structure saves space on the mobile device's printed circuit board and optimizes the use of available space on the antenna.

AVX Corp. announced its new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, WA.  Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO™ diplexer employs high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in a multilayer stack up.

AWR Corp., the innovation leader in high-frequency EDA software and Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter-wave devices, announce the availability of Version 10.1 of the Modelithics COMPLETE Library of passive and active device models for AWR’s Microwave Office® high-frequency design software.

After obtaining ISO 13485 certification in 2012 for medical devices, and in order to respond to the growing demand of customers in the medical and Hi-Rel applications, IPDiA unveils its ability to offer advanced foundry services.

AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations con­tain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.