Articles Tagged with ''component''

M/A-COM Technology Solutions Holdings, Inc., announced it has entered into a definitive agreement to acquire BinOptics Corp., a leading merchant provider of indium phosphide lasers for data centers, mobile backhaul, silicon photonics and access networks.

Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s assembly, cleaning, and reliability hands-on Workshop on June 10 in Franklin, Mass.

For the first quarter of 2014, vendors reported revenue affected by certain component shortages which are forecast to lift towards the end of the second quarter or the beginning of the third quarter this year.

Mentor Graphics Corp. announced the first phase of a new systems design enterprise platform to address today’s printed circuit board (PCB) systems challenges of increased complexity, changing team demographics, and systems-aware design requirements. The Mentor Graphics Xpedition™ platform significantly simplifies and accelerates the development of the industry’s most challenging designs. By combining an intuitive design environment with designer-driven automation, the Xpedition platform addresses the changing responsibilities of designers, including global team-based organizations, so that users can perform at expert levels for optimum productivity. The result is shortened product development cycles, minimized design re-spins, and improved product quality. The first phase of the launch announces new Xpedition PCB layout technology.

In a joint effort, Rohde & Schwarz and Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Inc., have extensively tested the user plane throughput of the new Qualcomm® Gobi™ 9x35  chipset in compliance with 3GPP Release 10 for LTE-Advanced. In the setup on display at Mobile World Congress, the R&S CMW500 wideband radio communication tester from Rohde & Schwarz simulates the LTE-Advanced network.

Aeroflex Ltd., a wholly owned subsidiary of Aeroflex Holding Corp., announced that the 7100 Digital Radio Test Set provides LTE-A carrier aggregation testing at full Cat 6 data rates of 300 Mbps downlink and 50 Mbps uplink simultaneously for  LTE-A in FDD mode, and now also supports carrier aggregation in TDD mode.

RFMW Ltd., announces the availability of a new white paper explaining the properties and advantages of various conductive rubber materials for use in RFI/EMI mitigation.

AEM Inc. announces that it is a recipient of a 2012 Boeing Gold Performance Excellence Award. AEM maintained a Gold composite performance rating for quality and delivery for the twelve month period from October 1, 2011 to September 30, 2012. This year, Boeing recognized 594 suppliers who achieved either a Gold or Silver level Boeing Performance Excellence Award. AEM is one of only 153 suppliers to receive the Gold level of recognition achieving this status for four consecutive years.

Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), is introducing a new online, easy-to-use, cascade analysis calculator that lets you choose between input or output specifications for each component in your system.