Articles Tagged with ''wireless''

Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications, announced that the CC2538 is the industry’s first ZigBee® wireless network processor to offer the three most popular ZigBee standards for one end-device (ZigBee Smart Energy™, ZigBee Home Automation™ and ZigBee Light Link™). Now a single end-equipment can support these three standards, offering a seamless user experience with fast switching between each standard making it seem like concurrent operation.

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard. Benefitting from its industry-leading integration levels and utilizing high-performance SiGe process technology, the new LX5586 RF FE provides significant performance and cost advantages over existing technologies.  

Cambridge Broadband Networks (CBNL) and NEC Europe Ltd. have announced a major agreement with QSC to provide high-speed wireless internet access to its enterprise customers. QSC, among the leading mid-size providers of ICT services in Germany, is installing CBNL’s VectaStar multipoint microwave equipment to meet the high-capacity internet demands of its enterprise customers across several cities in Germany. QSC’s initial deployment will consist of VectaStar access points and remote terminals, using the available 26GHz spectrum.

Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications,today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools.

EMSCAN will showcase the world's largest real-time antenna pattern measurement tool in Amsterdam at  EuMW 2012.

As wireless connectivity attach rates increase in many markets and OEMs continue to push for cost savings, IC vendors such as Broadcom, Qualcomm, TI, Marvell, MediaTek and others, have created integrated wireless connectivity solutions to gain market share. These solutions known as Wireless Connectivity Combo ICs have already seen rapid adoption in smartphones and are now seeing strong usage growth in many other end applications including laptops, flat panel TVs, and automotive infotainment systems.

Cree Inc. and Array Wireless help bring the clarity of high-definition (HD) video transmission to Sunday Night Football (SNF) on NBC. The HD NFL games are broadcast using wireless video systems from Array Wireless that employ Cree’s advanced GaN RF components. Array Wireless counts on Cree world-class RF GaN technology to create high efficiency, low distortion, robust power amplifiers that are essential for high-definition video transmission.

Cisco remains on the top spot of the enterprise Wireless Local Area Networks (WLAN) equipment market with 36 percent of the world market share followed by ZTE and Aruba based on shipments. Cisco has a dominating presence in North America and European markets, but is increasingly losing ground from close competition from ZTE in APAC, Latin America, and MEA.

Agilent Technologies Inc. announced it will demonstrate its newest LTE and WLAN test and measurement solutions, which cover the global technology and applications ecosystem for next-generation mobile broadband networks, at 4G World (Booth 322), McCormick Place West,  in Chicago, Oct. 30-31.

The market for mobile handset IC, including platform and connectivity ICs, surpassed $32 billion in 2011 and is forecast to grow a further 11 percent in 2012 to reach $35.7 billion. Growth is being led largely by the smartphone segment, with ultra-low end handsets also growing strongly. “Qualcomm stands out as the market leader with 26 percent overall share in 2011,” stated Peter Cooney practice director, of semiconductors,  “its continuing focus on the handset market and in particular its efforts to increase platform integration look set to further strengthen Qualcomm’s hold on the market in the near term.”