StratEdge, leader in the design and production of semiconductor packages for microwave, millimeter-wave and high speed digital devices, will display its high power, high performance, DC to 50+ GHz packages at the IEEE MTT 2010 International Microwave Symposium (MTT-S) booth #2021. StratEdge has an extensive catalog of standard packages designed for high reliability, high frequency and high power applications. With patented electrical transition designs, StratEdge packages have an insertion loss maximum of ½ decibel per transition. Many standard packages are capable of passing MIL-STD 883 and MIL-PRF 38534 testing standards for high reliability military and space applications.
StratEdge will display products from its six standard product lines, featuring new developments in the surface mount and power package families. StratEdge surface mount packages are fully hermetic, leadless packages with ceramic and metal bases. They are built to match industry-standard outlines, enabling them to be used as direct replacements for traditional quad flat package designs. The power package family has been expanded to include a wider variety of high thermal conductivity bases that can better dissipate the heat produced by high power devices, such as GaN chips. High thermal conductivity bases are now available on a variety of StratEdge standard packages.
"High power devices are smaller and hotter than previous devices and it is difficult to find a good package match in the marketplace. That's why we continue to concentrate on developing and testing materials for new packages," explained Tim Going, StratEdge President. "StratEdge is dedicated to finding the best package solutions for its customers. We design and manufacture all of our packages in our San Diego, CA headquarters."
StratEdge will also highlight its microelectronic assembly services and turnkey package solutions, core competencies for over ten years. StratEdge can obtain commercially available devices, perform assembly and testing services, and ship finished parts ready for the next level of assembly. Experienced design and manufacturing personnel provide precision placement and attachment of high frequency and high speed devices, ensuring maximum device performance is achieved.
The IEEE MTT 2010 International Microwave Symposium is being held at the Anaheim Convention Center, Anaheim, CA, from May 25-27, 2010. It is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. StratEdge application engineers will be available at the StratEdge booth to discuss individual device designs and package requirements and options.
