Nextreme, a manufacturer of micro-scale thermal and power management products for the electronics industry, is relocating and expanding its North American corporate headquarters and manufacturing facility within Research Triangle Park, NC. Increasing Nextreme’s production capacity, the 14,000 square-foot, state-of-the art facility includes semiconductor grade clean rooms and an advanced application laboratory to better serve customer needs as Nextreme enters product qualification, pilot production and ultimately volume production.

“To meet market demands, we are relocating to facilitate the evolution of our technology into full-scale production,” said Jim Mundell, Nextreme chief operating officer. “Our recently announced Thermal Copper Pillar Bump removes the barriers to large scale implementation of embedded thermal and power management in flip chip applications, which represents exponential growth for Nextreme.”

Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging. This breakthrough in flip chip process technology, addresses two of the most serious issues in electronics today – thermal and power management. Nextreme’s approach uses a proven, fully scalable technology to deliver new, enabling functionality in flip chip applications.

The flip chip market is one of the largest and fastest growing semiconductor packaging industry market segments. Potential flip chip applications for Nextreme's thermal bump include microprocessors, display drivers, chip sets, RF devices, medical devices, watches, smartcards and analog/mixed signal devices.

Nextreme’s new facility is located at 3908 Patriot Drive, Durham, NC 27703. Nextreme expects to complete the move by the end of December 2007.