A new start-up company, GraSen Technology LLC, has been established to provide technology solutions in the growing requirements for Heterojunction Bipolar Transistor (HBT) and Heterostructure Field-Effect Transistor (HFET) devices in the US and international commercial communications and defense electronics markets.
GraSen Technology's HBT and HFET products are designed in the company's San Jose, CA engineering offices and are manufactured, tested and packaged in three qualified semiconductor foundries in order to need any small-to-large volume production requirements.
HBT and HFET packaged products are available off-the-shelf. Unpackaged chip devices are available within eight weeks ARO. Surface-mount packaged products are lead-free and RoHS-compliant. All GraSen products are visually inspected to commercial standards. Additional screening and inspection is available.
Founders of GraSen Technology include Brad Senge, president and chief executive officer, and Stan Gray, chief technical officer and chief operating officer. Senge has over 33 years experience in the RF and microwave, and semiconductor product areas specializing in component and system design, manufacturing, program management, and marketing for wireless communications and defense electronics applications.
Gray has over 30 years in the design and manufacturing of semiconductor devices for a wide range of applications in commercial wireless communications and military electronics systems and subsystems.
According to Brad Senge, "Our current offerings of HBT and HFET products meet the growing demand of design, production and delivery requirements of the wireless communications and defense electronic markets." GraSen Technology is a Vietnam Veteran-owned small business "that is better positioned to meet quick response to the ever-changing markets we serve," he continued.
Stan Gray explained that, "GraSen Technology also offers our customers contract design and transfer services to those needing specialized products for their own proprietary requirements including CMOS, RF power amplifier or high-speed logic circuits, RF amplifier assembly, MCMs, MMICs or MICs." Mechanical housing and packaging design services are also available.