Rogers Corp. will showcase several advanced circuit materials at the IEEE MTT-S International Microwave Symposium (IMS) 2007 in Honolulu, HI, June 5-7 (booth # 843). These products are used in a wide range of high frequency applications, including the advanced packaging, antenna and power amplifier markets.
As a pioneer in the advanced circuit materials field, Rogers Corp. has helped shape the high frequency marketplace by developing innovative products such as the RT/duroid® 5000 series, RT/duroid® 6002, RO3000®, RO4000® and TMM® laminates. Rogers Corp. also has global resources with offices located in Europe and the United States, as well as a strong presence in the Asia Pacific with facilities in China, Singapore, Japan, Korea and Taiwan.
Products that Rogers Corp. will display at IEEE/MTT-S IMS 2007 include:
Advanced Packaging Materials
• Thermoset Materials: Products such as RO4350B™, RO4450B™ RO4450D™ laminates offer low moisture absorption and low loss, as well as FR4 and lead-free multi-layer processing capabilities. They are also available in 0.004" to 0.060" thicknesses.
• Thermoplastic Materials: The RO2800® and ULTRALAM® 3000 materials are available in thin dielectric layers (0.001" to 0.004") and exhibit low loss and low moisture absorption. They also are lead-free, making them environmentally friendly.
New Enhanced Copper Bond Technology
• This low profile copper technology provides tighter trace width tolerances, lower insertion loss and improved passive intermodulation at high operating frequencies.
Antenna Grade Materials
• These wide range of antenna grade materials exhibit losses as low as 0.0013 and PIM values better than -155 dBc. A variety of options including thick dielectric grades and high Dk are also available.