Quantum Leap Packaging Inc. (QLP), a provider of high performance, air cavity packages for semiconductor assembly, has announced the availability of HermeTech™, the industry's first hermetic plastic package that meets JEDEC standards.
QLP is manufacturing HermeTech plastic air cavity QFNs that maintain hermetic leak rates of less than 5x10-8 atm cc/s He and pass full Mil Spec reliability tests.
Through a combination of its unique Quantech material technology, and innovative UltraSeal™ ultrasonic lid process, QLP has developed HermeTech plastic hermetic QFNs that feature tailorable properties, low moisture permeability and high temperature stability that enable true hermetic performance.
HermeTech QFNs are ideal for advanced packaging applications such as Image Sensors, HB-LEDs, MEMs, LDMOS and RF microwave devices.