AI took over Mobile World Congress Barcelona 2025 as the event was very well attended with 109,000 attendees from 205 countries and territories. There were more than 2,900 exhibitors, sponsors, and partners with over 1,200 speakers and thought leaders. There were also many applications for 5G advanced (NTN seemed to be the most prevalent) and some 6G demos along with mmWave arrays for FWA and other applications. Here is a link to our photo gallery.
For some examples of AI, here is a quick summary of AI in RF applications that we came across:
DeepSIG showcased its latest innovations in spectrum awareness, Open RAN performance and AI-native RAN through collaborations with Airspan, Anritsu, NVIDIA, PC-TEL and the AI-RAN Alliance, to demonstrate how real-time spectrum intelligence and AI-powered solutions solve critical challenges in wireless networks, from interference detection to network efficiency and security. I saw their demo in the Anritsu booth showing how they could automatically identify various kinds of signals using a spectrum analyzer. Digital Global Systems is a next-gen software platform for wireless deployments that characterizes the Radio Frequency environment across multiple dimensions. With visibility at the network edge, network operators can de-conflict RF environments, optimize spectrum sharing, and fully realize their 5G ambitions. They are also helping satellite operators Advanced RF awareness and spectrum management. SynaXG who is integrating AI-driven RAN intelligence with carrier-grade L1 PHY software, delivering high performance, efficiency, and scalability for 5G, 6G, and beyond. Keysight collaborated with Samsung and NVIDIA to train AI models for Samsung’s 5G-Advanced and 6G technologies. This enables Samsung to integrate a powerful AI model in their vRAN software solution. Rohde & Schwarz continues to push the boundaries of AI-driven wireless communication research with its latest milestone in neural receiver design and testing with the latest proof-of-concept, developed in collaboration with NVIDIA, that integrates digital twin technology and high-fidelity ray tracing to create a robust framework for testing 5G-Advanced and 6G neural receivers under realistic propagation conditions. Qualcomm features AI in their processors, modems, and RF platforms and with IBM announced an expanded collaboration to drive enterprise-grade generative AI solutions across edge and cloud. I am sure there are many more examples but will cut it off here.
The exhibition is huge with 8 large halls so there is no way to see all of the companies during the week. Ericsson always has one of the nicest booths with refreshments available all day. Huawei has the largest booth and takes up the better part of Hall 1 but there is limited access to most of it. IBM had an interesting application of AI where you could play ping pong or foosball, and the AI would observe the game and give a detailed analysis of the playing style and performance of each player.
We spent our time in the exhibition, here is what we saw at various booths:
Aethertek was featuring mmWave antenna in modules covering 5G bands n257, n258 and n261. They use Qorvo or ADI beamformers to manufacture the various arrays and have bandwidths up to 400 MHz. This was a new company to us based in Taiwan.
Analog Devices introduced its new energy-efficient Titan O-RU platform at MWC 2025. The platform is powered by the ADTV906x Radio Unit and supports micro-sleep DTX, which saves up to 40% of energy during low traffic load. To monitor the platform’s energy consumption, the Titan O-RU was verified in a live demonstration under various time-distributed traffic models according to the ETSI 202 706-1 specification, using a comprehensive test solution from Rohde & Schwarz and VIAVI Solutions Inc. This test solution is based on the R&S RTO6 oscilloscope and R&S NGP power supply from Rohde & Schwarz and the TM500 O-RU Tester and O-RU Test Manager Application (O-RU TMA) from VIAVI Solutions. ADI was also featuring reference designs to accelerate time to market including 55 dBm EIRP AiB module Gen3 beamformer, AoB module with Gen3 CPE IC, 4T4R Open RAN RU SoC, FR3 RF Front end, AiB 39 GHz circularly polarized with Gen2 beamformer, AoB module with Gen2 beamformer and 8T8R 4G/5G RU. They also had a nice display of the various ADI powered radio units from many companies in the cellular market.
Anritsu showcased its industry leadership helping to improve the performance of today’s 5G networks, and accelerate future wireless and optical connectivity, for the digital transformation of industries. Key highlights at the stand will include AI-powered test tools, virtualized solutions to accelerate UE protocol development, an advanced digital twin simulation environment for C-V2X, and NTN mobility device testing. Anritsu also shared findings from its research collaborations for 6G, including advancements in evaluation of FR3 RIS surfaces together with LGU+, POSTECH and Corning at RAPA, a dynamic RIS provided by TMYTEK, and industry leading FR3 channel sounding with Aalborg University. Visitors can also explore demonstrations of AI-driven network assurance and customer experience monitoring, together with Private Network service assurance solutions.
DeepSig showcased its latest innovations in spectrum awareness, Open RAN performance and AI-native radio access networks (RAN). Through collaborations with Airspan, Anritsu, NVIDIA, PCTEL and the AI-RAN Alliance, DeepSig demonstrated how real-time spectrum intelligence and AI-powered solutions solve critical challenges in wireless networks, from interference detection to network efficiency and security.
After being in stealth mode, Digital Global Systems (DGS) talked about how it leverages patented AI technology in its RF Awareness platform to help satellite operators and their partners to effectively manage increasing network complexity and create new revenue-generating opportunities in a changing space market. With the impending growth of direct-to-device satellite activity and increasing numbers of consumer, enterprise, and military devices and applications, the LEO satellite environment is rapidly becoming a more crowded one in which to operate. Advanced RF awareness and spectrum management are key to ensuring unimpeded scalability and reliability for all applications. The direct-to-device (D2D) satellite services market is expected to take off in 2025. As the air interface portion of the network becomes more filled with D2D users, satellite operators with DGS’ RF Awareness technology will be able to leverage patented AI techniques to monitor and help mitigate interference, while striving toward more autonomous and self-optimized network operations. In addition, DGS has demonstrated that its AI techniques can be used to reduce the computational processing required to establish D2D links by 25% to 40%. This efficiency improvement translates to lower power consumption and related costs.
They discussed how RF front ends need to receive wider bandwidths so AI can be used to sense the signal environment, and they transmit on frequencies now being used. The AI algorithms can also predict what frequencies will be used in the future too so that there is no interference, so less energy is needed to transmit the signals.
The Ericsson pavilion had a huge number of demos and new equipment. The were featuring differentiated connectivity use case such as AR Glasses as an example of how communications service providers (CSPs) could benefit from differentiated connectivity. In this case you're going to need ultra-low latency and very high uplink and downlink capacity. Private 5G was another area of emphasis and has a key role in industry digitalization. Pointing to the recently announced partnership with JLR (formerly Jaguar Land Rover) at its Solihull complex in the UK, they said it was an example of the transformative capabilities of Ericsson Private 5G. Ericsson recently created a new venture, Aduna, of which Ericsson is a founding member, aimed at creating a new ecosystem to access advanced network features through network APIs. By forming a JV together with some of the leading operators in the world, they are now creating the supply of network APIs. They had several recent Aduna announcements – with Japan’s KDDI, EnStream in Canada, U.S. CSPs – as evidence of how the ecosystem is growing.
An interesting
Finwave Semiconductor strengthened its commitment to addressing the increasingly demanding wireless communication landscape by signing a global distribution agreement with RFMW. This partnership represents a significant step in Finwave’s evolution from a technology-driven company to a product-driven company. By adding Finwave’s portfolio – which includes high-power RF switches and upcoming RF power amplifiers – RFMW enhances its line card, filling a key gap and broadening its offerings to customers. They are producing GaN switches and qualifying GaN PAs.
Fujikura was featuring their 28 GHz phase array PAAM that operates at 24.25-27.5 or 26.5-29.5 GHz and can transmit and receive dual polarizations. It integrates beamformer ICs, frequency conversion IC, band pass filters and array antenna into one module that benefits customers with optimal TCO and reduced development time. The EIRP is 48 dBm at 3% EVM and is a scalable configuration with 8x8 element PAAM unit. It is does not need calibration and has fast beam switching of less than 220 ns and support greater than 20,000 beams.
Keysight Technologies is collaborating with Capgemini to integrate and validate 5G new radio non-terrestrial networks (NTN) in both transparent and regenerative modes. This collaboration aims to accelerate Capgemini’s development of its 5G NR NTN ready radio access network (RAN) framework. Regenerative NTN RANs represent a significant leap in 5G technology. These networks amplify and process signals, enhancing communication quality and reliability. Keysight’s UeSIM UE Emulation RAN solution effectively tackles the challenge of emulating multiple NTN-enabled user devices through its advanced integrated channel simulation capability. This solution allows the testing of NTN network protocols at scale, with precise orbit channel modelling, additionally enabling the realization and demonstration of the NTN Beam Management concept. By leveraging Keysight UeSIM UE Emulation RAN solution, Capgemini successfully tested its 5G NR NTN RAN software (in regenerative and transparent architecture) for LEO/MEO/GEO constellation usage.
Keysight Technologies collaborated with Samsung and NVIDIA to train AI models for Samsung’s 5G-Advanced and 6G technologies. This enables Samsung to integrate a powerful AI model in their vRAN software solution. The project is being developed at the AI-RAN Alliance as a work item. Keysight’s Channel Emulation Solutions provide channel generation capabilities for a wide variety of channel conditions, along with real-time signal processing and radio frequency (RF) capabilities. Samsung successfully generated advanced AI models for channel estimation in the uplink receiver, resulting in significant gains observed in the lab environment. For example, simulated experiments showed a 30% better cell edge throughput by using an AI model for channel estimation instead of the current static rules-based approach. The performance evaluation of this AI model was conducted using an end-to-end setup that included Samsung’s radio point, and a distributed unit (DU) based on the NVIDIA AI Aerial platform. It was implemented on the NVIDIA GH200 Grace Hopper Superchip platform, and Keysight Channel Emulation and Core Emulation Solutions.
Kyocera announced the development of a new transmission-type metasurface film capable of redirecting radio waves in a desired direction. This innovative metasurface film can be applied to surfaces such as window glass and acrylic stands, expanding the service area of millimeter-wave 5G and 6G networks while maintaining aesthetic considerations. With Kyocera's proprietary element structure, the film maintains high radio wave refraction properties comparable to conventional metasurface plates in a flexible film. It consists of three layers: an adhesive layer, a metamaterial layer, and a protective layer, with an overall thickness of approximately 200μm. This ultra-thin structure allows for easy installation without special construction, enabling simple attachment to windows, acrylic stands, and other existing structures to function as a radio wave relay point for expanding service areas. Kyocera conducted tests in an indoor millimeter-wave (28 GHz) 5G environment to evaluate the effectiveness of the metasurface film. In these tests, a mobile device was placed in an area with weak signal coverage from the base station, resulting in low signal reception. When the metasurface film was applied to a window glass, the transmission speed was observed to improve significantly, with download speeds increasing by up to 2.7 times and upload speeds improving by up to 5.2 times. Kyocera also featured millimeter-wave solutions and demonstrated a multi-beamforming Phased Array Antenna Module (PAAM). This module can generate up to 8 different beams at different frequencies and focus them in different directions. The demo with R&S showed 4 beams at different frequencies being steering separately.
KT successfully demonstrated 5G non-terrestrial network (NTN) technology in a satellite communication environment with long propagation delays. It used a method that accurately calculates path loss between the satellite and device based on their varying distance over time, without using retransmission techniques (HARQ-less). As a result, a bandwidth of more than 10 Mbps was achieved at approximately 35,000 km between the satellite and user device, enabling full HD video transmission. The NTN digital twin testbed from Rohde & Schwarz and VIAVI Solutions was used to develop this technology. The testbed is based on the CMX500 one-box signaling tester and the VIAVI TM500-AS2 Network Tester.
Lockheed Martin, Nokia, and Verizon announced the successful integration of Nokia’s industry-leading, military-grade 5G solutions into Lockheed Martin's 5G.MIL® Hybrid Base Station (HBS). The technology advances new capabilities to integrate commercial 5G connections with military communications systems to provide decisive information for national defense. 5G is playing an expanding role in supporting tactical military missions, seamlessly complementing existing battlefield solutions.
Nokia and its ecosystem of industry partners, KDDI, SoftBank Corp., T-Mobile US, and NVIDIA today outlined the advances made in the deployment and optimization of revolutionary AI-powered Radio Access Networks (RAN) as well as the future architecture for AI-RAN. These joint efforts will lay the foundations for developing platform-as-a-service business models for CSPs, which helps them unlock new monetization opportunities by offering scalable computing infrastructure and capabilities for processing AI and other services. Under its any RAN approach, Nokia is evolving Cloud RAN solutions to include AI computing in the shared infrastructure to maximize resource efficiency for operators. To accelerate the innovation and development of AI-RAN, Nokia is establishing an AI-RAN Center at its offices in Dallas, U.S. The center will enable Nokia’s partners to develop and test AI-RAN solutions in real-world network conditions with a focus on creating innovative use cases, prototypes, and to validate AI-RAN reference architecture.
Peraso makes mmWave modules that provide complete USB 3.0 to 802.11ad solutions for high-speed wireless applications including Fixed Wireless and Enterprise data networking infrastructure. The modules utilize the Peraso X720 and X130 60 GHz phased array chipsets which include a baseband processor and mmWave beamforming transceiver RFICs. The modules incorporate phased array antennas which offer a variety of gain and field-of-view options. The antenna is integrated into the PCB and provides uniform performance over the entire license-free 60GHz band. The Baseband processor, the PRS4601-B2E, provides MAC and PHY layer functionality necessary for IEEE 802.11ad operation and supports point-to-point or point-to-multipoint capability. Peraso offers a variety of software/firmware versions which are optimized for common applications.
Proximus Global announced that it will partner with Nokia to explore opportunities that utilize their respective strengths in network API solutions to support developers as they create new applications for enterprises. The collaboration aims to expose Proximus Global and Nokia APIs on each other’s marketplaces, bridging the gap between the various industry segments and the telecom ecosystem.
pSemi announced the smallest integrated PA-LNA-SW Internet of Things (IoT) FEM: the PE562212. Designed in support of Thread® and Matter® connectivity protocols, industry frameworks that focus on simplifying connected experiences, the PE562212 is an ultra-compact multi-protocol 2.4-GHz FEM with industry-leading noise figure that enables extended wireless range. It is housed in a 14-lead 1.8 × 1.8 × 0.63 mm LGA package (MSL3), specifically designed for space-constrained applications, delivering superior flexibility and value to IoT device makers. It enables connectivity across Thread, Zigbee®, Bluetooth® BDR/EDR, Bluetooth Low Energy (Bluetooth LE), and low-to-medium throughput Wi-Fi® (MCS7) and 2.4 GHz proprietary applications. The new IoT FEM is designed with both efficiency and linearity in mind as it enables higher data rate applications such as Wi-Fi, striking the delicate balance of adequate linear power with power efficiency. It has up to +21-dBm output power and digital Tx gain control of 1-dB steps with a 15-dB range. It also delivers industry-leading receive (Rx) capability (1.6 dB NF, typical) and low-loss bypass path (-0.6 dB, typical) with a GPIO control interface.
Qualcomm is involved in so many areas it is hard to summarize all of them. They were demonstrating lower band spectrum design to increase capacity at the lower frequencies while also using mid-band for future applications. For expanding capacity in other areas, they have Giga-MIMO and super-QAM in FR3.
They are also leveraging technology advancements like digital twins and AI, to improve system efficiency. Their 6G vision is an AI-native system where AI is seamlessly integrated across multiple layers of the network and within devices. To achieve this vision, a key research focus is on how AI in both the network and devices can collaborate to deliver tangible system benefits. That work has already begun with the design of two-sided AI-enhanced channel state feedback (CSF) in 5G Advanced. They are working closely with industry leaders like Nokia Bell Labs and Rohde & Schwarz to demonstrate the benefits and scalability of this new AI-enhanced air interface design.
Leveraging existing wireless infrastructure for purposes beyond communication is an exciting frontier. One leading use case is enhancing wireless communications by gaining a deeper understanding of the environment, such as the blockage locations. This approach can achieve important benefits, like device power savings with reduced overhead exchanges. For their demonstration in this area, they are using real-time raytracing to create a high-fidelity digital twin of the environment.
Rohde & Schwarz announced the successful validation of machine learning-based channel-state information feedback compression for 5G-Advanced networks with support from Qualcomm Technologies, demonstrating a significant increase in throughput compared to conventional methods. This breakthrough confirms the feasibility of cross-vendor AI implementation in wireless communications with the aim of enhancing network performance. The two companies achieved interoperability between ML models running on a mobile form factor reference design powered by a Qualcomm® 5G Modem-RF and the CMX500 5G one-box signaling tester from Rohde & Schwarz, implementing enhanced CSI feedback mechanisms studied in 3GPP Release 18 and 19. The setup enables efficient compression of the channel state based on CSI reference signal (CSI-RS) measurements, optimizing massive MIMO operations critical for 5G networks. This validation demonstrated that the throughput performance improved by 51% compared to Type I feedback followed by wideband precoding, as defined in 3GPP Release 15.
NXP and Rohde & Schwarz collaborated to demonstrate a test setup for UWB radar target simulation. The demonstration, being the first of its kind, verified the unique performance of the NXP Trimension™ NCJ29D6A chipset including the enhanced radar algorithms. It is capable of generating UWB radar targets with a variable target distance down to a few centimeters, enabling maximum control and reproducibility of the simulated scenario.
Murata and Rohde & Schwarz collaborated to introduce the world’s first testbed for Voice over Narrowband Non-Terrestrial Network (NB-NTN). With this demonstration, the two companies set a new standard for satellite-based communications, paving the way for voice capabilities even in the most bandwidth-constrained environments. The testbed utilizes the CMW500 wideband radio communication tester from Rohde & Schwarz as a GEO/GSO satellite eNB emulator, along with Murata's Type1SC Cat.M1/NB-IoT/NB-NTN module featuring the Sony’s Altair Chip ALT1250. It also employs a VoIP client application developed by Rohde & Schwarz, which uses codecs that operate at ultra-low bitrates. This technology addresses critical communication needs where traditional networks are inadequate. The demonstrator opens the door for push-to-talk-like NB-NTN applications, making it particularly suitable for emergency situations, disaster response, remote areas, and maritime operations.
Rohde & Schwarz expanded its vector network analyzer portfolio with the R&S ZNB3000, which offers best-in-class RF performance. It combines high measurement accuracy with exceptional speed. With its high throughput rate, the new vector network analyzer is especially suitable for high-volume production and short ramp-up time environments such as large-scale production of RF components. Innovative PCB-based frontends offer higher stability and minimize thermal drift allowing reliable measurements over several days without recalibration. With frequency ranges from 9 kHz to 4.5 GHz, 9 GHz, 20 GHz and 26.5 GHz, the R&S ZNB3000 addresses applications in the communications, electronic goods and aerospace industries as well as in the design of digital high-speed printed circuit boards and cables. They had many other demonstrations including AI neural receiver, 6G Sub-THz waveform candidates for OTA testing, NTN testing, mmWave beamforming OTA testing, and more.
Sivers Semiconductors unveiled a new line of antenna array products and evaluation kits for millimeter-wave SATCOM and 5G applications. These products represent a positive shift forward for Sivers’ Wireless Business Unit, from chips to antenna arrays. These latest solutions also enable rapid design-in and accelerated time-to-market for customers, since the design, manufacturing and test of millimeter-wave antenna arrays, particularly large arrays targeting SATCOM and 5G infrastructure applications, is complex and time consuming. Over the course of 2025, the following products will be introduced by Sivers Wireless: An unlicensed 5G millimeter-wave (57-71 GHz) 16-element transmit-receive single-aperture dual-polarized antenna array module supporting +34 dBm EIRP standalone (higher with an integrated lens or reflector) and be available for purchase immediately. A 26.5-29.5 GHz 5G millimeter-wave dual-polarized 128-element antenna array evaluation kit (EVK) based on the SUMMIT 2629 beamforming IC achieving +60 dBm EIRP at 3% EVM for full-bandwidth 64-QAM and is available for purchase immediately. A SATCOM 17-21 GHz receive, and 27-31 GHz transmit array panels for high-performance ground terminals, will be available in Q3 2025. A 24.25-27.5 GHz 5G millimeter-wave dual-polarized 512-element antenna array panel based on the SUMMIT 2427e beamforming IC, will be available in Q4 2025.
Skyworks was featuring their Sky 5 and IoT products. Sky5® is a highly flexible, customizable solution that meets the challenges of 5G wireless communications. Delivering excellent performance, footprint and power efficiency, the platform supports both 5G network infrastructure and user equipment to rapidly enable revolutionary applications across mobile and Internet of Things (IoT) ecosystems. Leveraging our technology leadership, broad systems expertise and operational scale, Sky5® streamlines 5G architectural complexities with highly integrated transmit/receive front-end solutions and diversity receive (DRx) modules. Designed for new spectrum in the sub-6 GHz range, the products offer a MIPI® interface, are baseband agnostic and comply with 3GPP standards. We will design, engineer and manufacture any Sky5 product to meet your specific needs.
Soitec has expanded its offerings every year and has four product lines: RF-SOI, fully depleted SOI (FD-SOI), Power-SOI, and piezoelectric-on-insulator (POI) for RF filters. They are also adding photonics SOI and have an interesting vision for 6G using InP chiplets. We hope to get an article from them outlining all of their product lines and future vision for RF materials.
ThinkRF was featuring their real-time, continuous insights and analytics, empowering regulatory agencies and network operators to optimize spectrum utilization, mitigate interference and enhance network performance like never before. With Plug & Play network monitoring and intuitive graphical view of comprehensive wireless insights, workloads are drastically reduced while improving the quality and reliability over traditional manual processes.
Verizon and its collaborators Ericsson and Qualcomm announced another large leap forward in advancing high speed wireless networks. Using a combination of two TDD carrier component aggregation with C-band spectrum and uplink MIMO (Multiple Input, Multiple Output) technology, the companies achieved a US record-breaking 480 Mbps uplink speed using sub-6 GHz spectrum. In the demonstration of technological capabilities, Verizon, Ericsson and Qualcomm Technologies used 200 MHz of C-band spectrum, employing 2x2 MIMO on each 100 MHz channel, hosted on Ericsson’s state-of-the-art Generation 4 RAN Processor 6672 and Massive MIMO TDD antenna integrated radio AIR 6449.
Viavi Solutions showcased advances underpinning the key shifts in the telecom industry with over 20 companies. Their collaborations included Calnex Solutions for network test, Infosys for cloud-based network management, leveraging Infosys Cobalt, and Samsung, NVIDIA, the Singapore University of Technology and Design (SUTD) and Yonsei University for AI-RAN. Collaborations on 6G featured A*STAR Institute for Infocomm Research (A*STAR I2R), King’s College London, Nokia Bell Labs and Qualcomm Technologies, Inc. Showcases for non-terrestrial networks (NTN) included Industrial Technology Research Institute (ITRI), KT and Rohde & Schwarz. Open RAN demonstrations showed VIAVI’s work with CableLabs, Calnex Solutions, Capgemini, Digital Catapult, Ericsson, i14y Lab/EANTC, Mavenir, Pegatron 5G, Quanta Cloud Technology (QCT), Radisys, Rohde & Schwarz, StarHub, SUTD, Synergy Design Technology and VVDN Technologies.
ZTE Corporation, in partnership with China Mobile, has jointly hosted the 5G-A x AI Results Release Event, unveiling two major innovations in "Communication-Sensing-Computing-Intelligence" and "Ambient IoT" at MWC Barcelona 2025. This milestone not only marks a significant step in the deepening collaboration between the two parties in 5G-A x AI but also injects new vitality into the global digital transformation process. ZTE, in collaboration with China Mobile, has introduced the "Communication-Sensing-Computing-Intelligence" Solution based on 5G-A technology, achieving deep integration of three core technologies:
- The integration of communication and computing establishes a robust foundational capability, accelerating digital transformation across industries.
- The integration of communication and intelligence enhances operational efficiency and optimizes user experience by embedding AI capabilities into the network.
- The integration of communication and sensing provides high-precision sensing capabilities, enabling intelligent perception, precise scheduling, and real-time decision-making to support next-generation services.