New: ICI-DP Sets

Area of Application

  • Electromagnetic Fault Injection (EMFI)
  • EM Pulse Coupling

Hardware fault injection is recognized as a dangerous possibility to break secured systems. Analyzing weak points and hardening the devices is a key to comprehensively protect them. With the new ICI-DP set from Langer EMV-Technik more sophisticated EM fault injection attacks are possible allowing detailed research of secure elements. One of the key features of the new pulse probe is the extended voltage range which is used to generate the disturbance pulses. Up to 1000 V allow for finding new vulnerabilities. A second important feature is the possibility to emit two disturbance pulses within a minimum of 25 ns. This may enable successful attacks on systems which are hardened against a single disturbance event. In total/ Together with the newly available small probe tips down to 250 μm a higher variety of devices can be fault injected and analyzed more in detail.

Coming Soon: TroubleStar

Electronic assemblies can be disturbed by ESD processes. The problem with existing interference suppression technology for ESD phenomena is that the pulse parameters of test devices do not reach the values of an ESD process and are therefore rarely effective for interference suppression. Conventional pulse generators and tools used during development, such as burst generators and the Langer EMV-Technik GmbH SGZ 21 disturbance generator used during development, do not achieve the pulse parameters of an ESD process.

The rise time of an ESD process of approximately 1 ns and amplitudes in the range of approximately 6 kV are not achieved by these generators. ESD guns have these pulse parameters, but their resolution is far too low to isolate weak points. It is therefore not possible to analyze ESD weak points with ESD guns. Therefore, when troubleshooting with an ESD gun, it is not clear where the weak point is located. Weak points can therefore not be localized and electronic assemblies can only be suppressed with a great deal of time and trial and error. By using the differential special probes, the TroubleStar achieves field strengths on the electronic assembly in the small area that correspond to an ESD process. This makes it possible to reproduce the ESD process on individual components, which was previously only possible to a limited extent. This paves the way for the high-resolution detection of individual critical components or conductor runs.