Modelithic and Signal Edge Solutions (SES) have joined forces in a strategic partnership aimed at advancing signal integrity (SI) and power integrity (PI) modeling. By combining their advanced simulation and software model development and validation techniques, Modelithics and SES will collaborate to address critical challenges faced by high speed electronic and power electronic systems designers.

“This partnership represents a leap forward in our mission to provide comprehensive modeling solutions,” says Ben Dannan, founder and chief technologist of SES. “Together, we’ll set new benchmarks for accuracy and efficiency.”

Known for delivering top-tier models for RF and microwave applications, supporting a multitude of popular circuit and electromagnetic simulation tools, Modelithics brings industry-leading expertise to the table. Their comprehensive, measurement-validated, model libraries are trusted by engineers worldwide, and have been widely adopted by leading semiconductor companies, defense contractors, instrumentation companies and research institutions.

SES is at the forefront of innovation in simulation and modeling. SES specializes in cutting-edge simulation tools and design services for SI, PI and electromagnetic modeling.  

“We’re thrilled to collaborate with SES,” says Dr. Larry Dunleavy, founder and CEO of Modelithics. “Our joint efforts will help us to extend Modelithics’ strong expertise in simulation models for RF and microwave models for active and passive devices to apply to non-RF modeling needs in the high speed and power electronics application space.”

This partnership will result in new, robust model libraries that combine Modelithics’ established catalog of high frequency models, many of which are applicable to high speed SI/PI applications, with customized SI/PI models from SES. These libraries will empower engineers to achieve even greater accuracy in their SI and PI designs, speeding time to market. Together, Modelithics and SES aim to elevate the industry standard for SI and PI modeling.