StratEdge Corporation will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in booth 515 at the International Microwave Symposium (IMS), being held in Washington, DC, from June 18-20. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as GaN, GaAs and SiC. These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive and down-hole.

StratEdge has been a passionate supporter of IMS for decades. Their team of experts looks forward to meeting you face-to-face to discuss your high-frequency, high-reliability, high-power packaging needs. StratEdge’s molded ceramic packages are a convenient solution for space and defense applications and can be manufactured with thermally-enhanced metal bases that ensure efficient heat dissipation. Their post-fired ceramic packages are renowned for their electrical transition designs, which minimize electrical losses to an extraordinary degree.

StratEdge also has a state-of-the-art cleanroom, equipped with the latest precision wire bonding and die attach systems, backed by decades of microelectronics assembly experience. We are your premium turn-key assembler of high frequency devices.

“StratEdge packages have been used in applications requiring superb electrical performance and reliability since the 1990s due to their superior performance and high-reliability,” says Tim Going, president. “Our team of experts is looking forward to being in Washington DC and having the opportunity to discuss the benefits gained by using StratEdge packages, which include better efficiency and longer chip life.”