Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
Indium Corporation is a leading solder supplier for laser and optical applications. Gold-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion and oxidation-resistant solder joint possible.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s gold-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications.
Features include:
- Highly accurate solder volume and BLT control
- Precision edge quality
- Flat and free of warping or bends
- Optimized cleanliness control
- Default waffle-pack method
Indium Corporation’s gold PDA preforms are available in the following primary and development alloys:
Primary alloys:
- 80Au/20Sn
- 79Au/21Sn
Development alloys:
- 78Au/22Sn; 77Au/23Sn; 76Au/24Sn; 75Au/25Sn
- 88Au/12Ge
- 96.8Au/3.2Si
- 82Au/18In