Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, will showcase its component handling solutions for RF/microwave devices at the International Microwave Symposium in Washington DC June 16-24, 2024.
For more than 40 years, Gel-Pak has partnered with the world’s leading semiconductor manufacturers on designing protective device carriers for valuable RF components. The company will feature its newest innovations including its new Vertec® VRP boxes and VRV Vacuum Release Carriers. These silicone-free carriers look and function similar to the market-leading Gel-Box™, Gel-Tray®, and Vacuum Release Tray products, but with an alternative elastomer technology. The proprietary elastomer material is both static dissipative and non-silicone.
The company will also showcase its Textured Film Carrier products (BTXF), which are based on a reversible adhesion technology known as the Gecko effect. These device carriers use microstructures to securely hold components in place during shipping and handling yet allow for easy release. The film is ideal for in-process device handling and for shipping of packaged components. The product is available in 2”,4” , JEDEC standard trays.