Check out what's in store for IMS2024 in this show preview covering products expected to be on the expo floor. 

Aaronia AGAaronia AG

Aaronia AG will be presenting its revolutionary solutions for the future of spectrum analysis and frequency monitoring in Hall A, Booth 224.

The real-time spectrum analyzers of the SPECTRAN® V6 series are specially designed for near-field and far-field measurements, for locating signals or sources of interference or for monitoring EMC problems. The real-time bandwidth of up to 450MHz and the sweep speed of >3,000 GHz/s accelerate all necessary measurements enormously, thus saving time and money. The analyzers are also ideal for broadband frequency monitoring, for example to ensure the proper use of assigned frequency bands. The location and identification of illegal transmitters and the elimination of interference caused by them is also easily possible in conjunction with the broadband antenna arrays from Aaronia.

AGC Multi Material America

Visit AGC at booth 1012 to learn more about AGC Multi Material’s comprehensive material offering including PTFE and thermoset laminates and bondply solutions for satellite, automotive, telecom, medical, industrial, defense and RF components.  Ask about fastRise bondply materials, Meteorwave low loss substrates and the well-known TSM-DS3 and TLY PTFE materials.

Altum RF

Altum RF will showcase its featured products and technical expertise in Booth #510 at the Walter E. Washington Convention Center. Company leaders will be in the booth to answer questions about specific products, future plans and their decades of experience designing and delivering RF, microwave and mmWave semiconductors.

Altum RF’s lineup of broadband Q/V/E-band low-noise and medium-power amplifiers enable next-generation technology and high-capacity networks. Applications include test and measurement, SATCOM, sensing applications and point-to-point wireless communication for 5G and 6G networks. These high frequency amplifiers use advanced GaAs technology, which delivers low noise figure and linear amplification with less signal distortion at medium power.

ADPA1113 copy.pngAnalog Devices

Analog Devices expands their portfolio of GaN power amplifiers with the new ADPA1113, pushing the limits of commercial GaN. ADPA1113 enables next-generation signal generation and sensing goals across an array of applications, from multi-mission radars and EW transmitters to RF test equipment and beyond. ADPA1113 provides 40 W CW saturated output power at 40 percent PAE from 2 to 6 GHz in a 10 mm x 12 mm flange package.

Antenom 

Antenom will be exhibiting the 20 GHz Horn Antenna Kits for the first time at IMS2024 at booth 1262.  This kit can build the desired horn antenna structure using reusable Anten'it blocks up to 7.5 GHz, and at higher frequencies up to 20 GHz using curved blocks. Thus, instead of purchasing separate antennas for each antenna gain, many different apertures with different gains can be added to a single antenna.

The adapter part, to which the antenna connector is connected, is built with Anten'it blocks, while the aperture part is built with Anten'it blocks at frequencies up to 7.5 GHz, and with curved aperture blocks at higher frequencies.

Cadence

Join Cadence in their IMS educational sessions to learn how to improve your RF/microwave designs with workflows addressing MMICs, RFICs and modules, IC packaging, PAs, RF PCBs and 5G and radar systems.

  • Machine Learning (ML) and Analysis Advancements Embedded in a Complete High-Frequency Design Flow 
  • High-Frequency IC/Package Co-Design Using Integrated Toolsets 
  • PDKs for Microwave Design Platform Expand Functionality to Silicon MMIC Designers 
  • Enabling Electromagnetic Simulations with Encrypted Components  
  • Utilizing Real-World Signals in Simulation  
  • Advancements in Linear and Non-Linear Bidirectional Impedance and Stability Analysis 
  • Interoperable Design Platforms Support High-Frequency Silicon MMIC Design 

Copper Mountain Technologies 

Copper Mountain Technologies will showcase a new turnkey solution for customers needing to make far-field, mmWave and sub-THz antenna measurements above 18 GHz in booth 1111. The OTA antenna test system features a wide array of configurations depending on the user’s far-field requirements, antenna size, desired frequency range and antenna positioner functionality.

CMT has partnered with MilliBox and Eravant to offer a complete OTA antenna measurement chamber solution ranging from 18 GHz to 220 GHz. Each OTA system includes a benchtop compact anechoic chamber, a 3D antenna positioner (gimbal), sophisticated but intuitive measurement software, and other necessary accessories to fully set up a chamber for far-field antenna measurements. Each system is anchored by CMT’s 2-port 9 GHz Cobalt VNA and includes a set of frequency extenders for the measurement band of your choice.

Corning Incorporated 

Corning Incorporated will launch its Corning® Gilbert ® POLYLINKTM technology at IMS in booth 1213.  POLYLINK is the RF and microwave connectivity industry’s first gold-plated plastic microwave connector. At the symposium, Corning experts will also showcase Corning Gilbert’s traditional metal blindmate interconnects. These connectors are trusted by customers for use in telecommunications, radar systems, shipboard, airborne, and ground-based missile programs and for cryogenic and non-magnetic applications.

dB Control

dB Control is manufacturing mmWave MPMs that will be installed on military fighter aircrafts, and is developing MPMs and TWTAs for the Advanced Extremely High Frequency System (AEHF) joint service satellite communications system.

More information about dB Control’s full line of mmWave TWTAs and MPMs will be available in Booth 2112 at IMS2024: 

  • 26.5 to 40.0 GHz, 125 W MPM (Model dB-3201) 
  • 27.5 to 31.0 GHz, 200 W MPM (Model dB-3202) 
  • 30.0 to 38.0 GHz, 125 W MPM (Model dB-3201H) 
  • 32.0 to 36.0 GHz, 400 W TWTA (Model dB-3861) 
  • 34.5 to 35.5 GHz, 700 W TWTA (Model dB-3860) 
  • 34.5 to 35.5 GHz, 700 W TWTA (Model dB-3709i) 
  • 43.5 to 45.5 GHz, 80 W MPM (Model dB-3205)

Exxelia 

At booth 2108, Exxelia will highlight its main RF/microwave capacitor ranges: Super HiQ & High-Power High-Q CP/CL series and also its innovative range of microwave ferrites, including a pre-launch of a highly anticipated high-epsilon microwave ferrite material. 

Exxelia will also exhibit its comprehensive range of materials and tuning components, with a special focus on its cutting-edge microwave ferrite products. These advanced components are engineered to meet the rigorous demands of modern microwave applications, providing unparalleled performance and reliability.

As a highlight of their presence at IMS Microwave Week, Exxelia will be pre-launching a new high-epsilon microwave ferrite. This new high-epsilon ferrite is featuring a permittivity of 21 and is available in two versions (YK21 and DK21) to address all power applications. It represents a significant advancement in ferrite technology, engineered to enhance the performance of high frequency radar systems, especially in Active electronically scanned array radar applications. This new component delivers exceptional magnetic properties and stability, crucial for the optimal performance of isolator and circulator devices.

Gel-Pak

Gel-Pak will showcase its component handling solutions for RF/microwave devices at IMS2024. The company will feature its newest innovations including its new Vertec® VRP boxes and VRV Vacuum Release Carriers. These silicone-free carriers look and function similar to the market-leading Gel-Box™, Gel-Tray®, and Vacuum Release Tray products, but with an alternative elastomer technology. The proprietary elastomer material is both static dissipative and non-silicone

The company will also showcase its  Textured Film Carrier products (BTXF), which are based on a reversible adhesion technology known as the Gecko effect. These device carriers use microstructures to securely hold components in place during shipping and handling yet allow for easy release. The film is ideal for in-process device handling and for shipping of packaged components. The product is available in 2”,4”, JEDEC standard trays. Indium-IMS2024.jpg

Indium Corporation

Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at IMS. Gold-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion and oxidation-resistant solder joint possible.

International Manufacturing Services Inc

International Manufacturing Services Inc. will be exhibiting in booth 1945. Attendees can learn about IMS’s latest developments in passive thick- and thin-film components, including surface-mount-technology (SMT) resistors, attenuators, couplers, splitters and thermal management devices.

Engineering professionals from International Manufacturing Services Inc. will be on hand at the exhibition to share their expertise and experience in miniaturizing high-frequency passive components for the most demanding applications in aerospace, communications, defense, instrumentation, medical, and other applications. Visitors can learn more about high-thermal-conductivity aluminum-nitride (AlN) attenuators and resistors, optimized for: low duty cycle pulse; higher power, and; improved thermal transfer. They can also learn about both electrically isolated, board-level SMT thermal management devices, and; a range of nonmagnetic components that lend themselves well to medical applications

JARIET Technologies 

JARIET Technologies will be demonstrating ELECTRA at IMS in booth 2326. The ELECTRA architecture, already well established in the aerospace and defense market, is now being offered as a family of commercially available IC’s to enable broader customer access to JARIET’s leadership technology in a stand-alone package with an industry standard SERDES data interface. The common architecture and software environment used across the entire ELECTRA family reduces customer development cost and enables faster time to market while addressing multi-function and multi-domain application spaces. The 36 GHz bandwidth enables software-defined radio (SDR) at double the frequency previously possible and with signal instantaneous bandwidth (IBW) up to 6.4 GHz wide per converter. ELECTRA more than triples the clock rate of the nearest competitor’s ADC and  more than doubles the nearest DAC. The 10-bit 64 GSPS ADCs deliver 10 dB better noise spectral density and 17 dB better noise figure at 9.5 GHz than the best 14-bit ADCs.

Keysight Technologies

At IMS, in booth #721, Keysight’s microwave and RF experts will showcase solutions that accelerate spectrum innovations to help customers optimize 5G and pioneer 6G. Keysight will present the following demonstrations that are accelerating spectrum innovations:

  • Wideband Active Load-Pull – Showcases Keysight’s newly introduced wideband active load-pull (WALP) capability using a dual-channel VXG-C vector source and a PNA-X network analyzer to demonstrate the error vector magnitude performance of a power amplifier when presented with arbitrary frequency-dependent load impedances created without an impedance tuner.
  • AI/ML Enabled EDA – Demonstrates Keysight’s ADS 2025, which offers 3D Circuit-EM-Thermal multi-physics co-design, high-performance automation enabling AI/ML and robust design validation for RF and millimeter-wave, and provides support for wideband power amplifier design techniques, including nonlinear load-pull. Also shows how PathWave System Design 2024 U1 links to ADS through the new RF System Explorer as well as how ADS provides new communications PHY technology for 5G NTN systems design, while enabling training and use of AI/ML-based models, channels, provides RF-true phased array design for 5G and 6G systems.
  • Phased Array Antenna Test – Showcases Keysight’s phased array control and calibration test solution inside the Vertical Compact Antenna Test Range, which accommodates a wide variety of phased array antenna performance verification tests including fast gain and phase calibration, effective isotropic radiated power, antenna radiation pattern, antenna gain-to-noise-temperature (G/T), modulation distortion and radio frequency to direct digital measurements.
  • Signal Source Characterization – Demonstrates how to perform sub-THz phase noise measurements with Keysight’s new E5058A 54 GHz SSA-X signal source analyzer and an E5051AW phase noise measurement down-converter for 6G applications and microwave amplifier residual phase noise and AM noise measurements.
  • IQ Data Characterization – Highlights how Keysight’s vector signal analysis software uses a new feature to precisely characterize a homodyne (IQ) system by characterizing and digitally correcting the frequency-dependent dispersion and imbalance of a Marki IQ mixer.

Kratos Microwave USAkratos

Kratos has an extensive portfolio of power amplifiers covering 1 to 50 GHz with power levels ranging from 50 W CW to 2 kW pulsed for aerospace, defense, and instrumentation customers. Their capabilities extend into Integrated Microwave assemblies supporting various radar, EW and communications applications meeting unique mission specific electrical and environmental requirements. New product development in 2024 focused on frequency coverage of V- and W-Bands.

Kratos GaN SSPAs:
•  Small Form Factor
•  Decoys & Expendables
•  SAR, TCDL, UAVs
•  AESA Radar Systems
•  EW: ECM, ECCM & ESM

MACOM 

MACOM will be highlighting more than 14 technology demonstrations at the show, spanning its various product lines, including diodes, RF power, MMIC and linear modules and subsystems. The booth will feature the latest new product additions to the company’s broad product portfolio. MACOM will also be highlighting its expanded foundry services offerings at the show. Customers and attendees will have the opportunity to engage with MACOM’s design engineering, product management and applications engineering teams who will provide in-depth explanations of MACOM’s solutions and benefits.

IMS2024 demonstrations and new product announcements will include:

  • GaN-on-SiC MMIC Ka-Band Power Amplifier: This demonstration showcases a 6 W driver and a 10 W PA operating in the 33 to 37 GHz band. These parts are fabricated using MACOM’s 140 nm GaN-on-SiC technology.  
  • 300 W X-Band GaN-on-SiC Matched Power Amplifier: A new addition to the MACOM RF product portfolio, this amplifier is fully matched to 50 ohms at both input and output ports. Ideal for pulsed radar applications such as marine, defense and weather radar, it provides an ideal combination of output power, signal gain and drain efficiency in a small form factor at 9 GHz.
  • C-Band 100 W GaN-on-SiC Power Amplifier with 57 percent power-added efficiency (PAE):  This GaN Power Amplifier combines high gain and high efficiency for pulsed power applications within a small footprint (7 x 7 mm). This demonstration also features MACOM’s XP1044 driver amplifier and MACP-011113 surface mount directional coupler.
  •  250 W 2.4 to 2.5 GHz High Power GaN Pallet: This two-stage GaN Amplifier Pallet, part of MACOM’s recently expanded range of RF solutions, is tailored for industrial, scientific and medical  applications. This turnkey solution features the industry’s most efficient microwave CW transistor in a plastic package, enhancing cost effectiveness.
  • GaN-on-Si MMIC Low Noise Amplifier (LNA) with Fast Recovery Time:  By utilizing MACOM’s proprietary 100 nm GaN-on-Si technology, MACOM delivers robust low noise LNAs with industry-leading recovery time. This combination of ruggedness, low noise figure and fast recovery time make these LNAs ideal for radar and electronic warfare applications.
  • GaN Switch: This demonstration displays MACOM GaN-on-Si switch solutions highlighting a C-Band GaN switch with a P0.1dB of greater than 50 W. In addition, the company’s latest high frequency GaN-on-Si switch offerings will be on display.
  • Linearized Q-Band GaN PA MMIC for SATCOM: This demonstration highlights MACOM linearizer technology. Combining a Q-Band GaN-on-Si amplifier, designed for satellite communications, with a wideband analog linearizer, MACOM will show how it is possible to simultaneously achieve optimal linearity, PAE and output power for SATCOM.
  • Quad L-Band to Ka-Band Block Up-converter: This integrated solution offers excellent phase noise performance, an analog or digital interface and low sensitivity to microphonics. It simplifies system linearity and provides benefits in terms of cost, size, mass and complexity.
  • X-Band T/R Module (TRM) with 42 percent PAE: Designed for X-Band aerospace/defense applications, this demonstration highlights MACOM’s WSM5100S multi-chip module which integrates a high power GaN Switch, GaAs Limiter-LNA and GaN PA into a 7x7 mm QFN. This TRM delivers 5 W Output Power with industry-leading efficiency.
  • High Power Reflective SP2T Surface Mount Switch: Ideal for applications requiring high RF power and surface mount capability, this switch operates between 30 MHz and 5 GHz. It offers high CW power handling up to 200 W along with excellent insertion loss and switching speed, all within a compact package.
  • Broadband High Power Limiter: With an operating frequency of 2 to 18 GHz and peak power handling up to 1 kW, this RF limiter provides exemplary frequency, insertion loss and high power performance to meet the necessary requirements for receiver protection as well as ship and airborne radar applications.
  • High Power SOI Switch: This switch features low insertion loss and a symmetric topology, along with excellent linearity, making it perfectly suited for high performance communications systems. The demonstration utilizes a CMPA2060040D1 amplifier as a driver stage and a MACP-011113 surface mount directional coupler to highlight the SOI switch’s high compression level.
  • Integrated Filter Technology/Switched Filter Bank: This demonstration showcases MACOM’s various filter technologies and MACOM’s capability to integrate filters with other functions (in this case switches) to created switchable filter banks. This demonstration shows bulk acoustic wave, GaAs and Laminate filters highlighting the strengths of each technology and the potential integration options offered by MACOM.
  • Space and Hi-Rel Products: MACOM will exhibit a wide range of space and high reliability (Hi-Rel) components and capabilities for free space optics systems, including lasers, laser drivers, various photodiodes and transimpedance amplifiers (TIAs). In addition, the MACOM team will present examples of various RF-over-fiber analog photonic subsystems used in high performance satellite communication applications.

In addition to the product showcase, attendees can learn more about MACOM’s enhanced foundry services at booth #744.

MACOM Presentations During IMS2024:

  • Topic: “Characterization and Design of High-Power GaN-on-SiC Devices Through the Utilization of Application-Oriented Signals and a Comprehensive Segmented Modeling Approach”
    • Presenter: Zulhazmi Mokhti, Senior Principal Engineer
    • Date: 8:00 a.m. on Monday, June 17
    • Location: 146B
  • KEYNOTE: “Stability Analysis Methods for Microwave Power Amplifiers: A Modern Perspective”
    • Presenter: Dr. Thomas Winslow, Distinguished Fellow
    • Date: 1:30 p.m. on Wednesday, June 19
  • Topic: “HF Through UHF Techniques and Applications”
    • Presenter: Christopher Tenev, Senior Electronic Design Engineer, Linear Modules and Subystems
    • Date: 11:30 a.m. on Thursday, June 20 
    • Location: Room 145AB.

MathWorks

MathWorks will exhibit at IMS2024 in booth #2139 in Hall B.  In addition to hosting a variety of demos at booth #2139 in Hall B, MathWorks experts will be leading workshops and educational seminars with industry leaders throughout the event. IMS2024 attendees have the opportunity to discuss several wireless communications workflows with MathWorks experts including exploring 6G waveforms, including over-the-air testing with MATLAB; wideband radar and communication waveform classification with Universal Software Radio Peripherals; 5G waveform design and validation using MATLAB and Keysight test equipment; and measuring RF filters with Keysight VNA, creating MATLAB behavioral models, and tuning filter performance.

MCV Microwave

MCV Microwave will  host live demonstrations and showcase new products for mission-critical applications in Booth #342.

Live Demonstrations

  • Consistent performance of 10.7 MHz filter for audio and visual equipment.
  • Ultra-narrowed band 5G filter with high rejection 500 kHz from passband edge.
  • GPS cavity notch filter and L1/L2 ceramic duplexer for LTE signal suppression.
  • 5G C-Band ceramic filter for radar altimeter.

Product Portfolio

  • Ceramic Patch Antenna for Wi-Fi, Globalstar and GPS applications.
  • Metallized Ceramic Substrates and Single Layer Capacitors (SLC).
  • Precision tuned Ceramic Resonators.
  • High Performance Cable Assemblies.
  • Cavity Combiners.
  • Ceramic Monoblock and Waveguide Filters.
  • Lumped Element Filters and Integrated Assemblies.
  • Passive Components

MilliBox 

MilliBox will have several demonstrations displayed during IMS. Four demonstrations are shown at MilliBox booth 705 and three others will be shown by partners.

Booth 705: MilliBox unveils its new Compact Antenna Test Range system MBX32CTR. It consists of an MBX32 chamber, a GIM04-300E positioner and with the addition of a parabolic reflector and probe, it eliminates the far field distance constraints.  MilliBox also demonstrates its innovative approach to mmWave radar sensor testing with the combination of MBX32R chamber, GIM04-300X 3-axis antenna positioner and LIN04 linear actuated radar target controller. MilliBox showcases MBX03 chamber with GIM05-340, a Spherical Roll 3-axis positioner, capable of native 3D radiation pattern with very wide unobstructed view angle. Finally, Millibox shows the benefit of using the StabilityPlus line of RF cable assemblies from Maury Microwave for routing mmWave signals to a device under test mounted on MilliBox GIM04-230X 3-axis antenna positioner. 

Booth 1939: Eravant shows its integration of MilliBox GIM04-300E for its new Open Bed Compact Range with 150 mm of quiet zone. The use of a 3D positioner for this application allows for OTA measurement of a high precision 3D radiation pattern. Because GIM04-300E can mount sub-THz frequency extenders, this solution is suitable for measurements from 24 GHz to 170 GHz.

Booth 1111: Copper Mountain Technologies shows its new OTA-2H completely integrated OTA test system developed in cooperation with Eravant and MilliBox. MilliBox contributes a full chamber MBX32 and a positioner GIM04-300E, Eravant contributes the frequency extenders from the STO series up to 220 GHz, and Copper Mountain Technologies supplies the USB VNA Cobalt 4209. This constitutes the most accessible full OTA system package on the market.

mitsubishiMitsubishi Electric Corporation 

Mitsubishi Electric will exhibit its new 16W GaN PAM at IMS2024 in booth 1143. In September 2023, Mitsubishi Electric began providing samples of a GaN PAM that achieves an average output power of 8 W (39 dBm) over a wide frequency range from 3.4 to 3.8 GHz, suitable for 64T64R mMIMO antennas of 5G base stations. The 16 W (42 dBm) GaN PAM announced today achieves even higher average output power over a wide frequency range from 3.3 to 3.8 GHz and is suitable for 32T32R mMIMO antennas, extending the communication range of 5G mMIMO base stations and lowering their manufacturing cost by reducing the required number of PAMs.

mmTron 

In booth #1661, mmTron staff will be discussing the expanding product line of MMICs that are extending system capabilities in fixed wireless access (FWA), satellite communications, aerospace and defense and instrumentation. At IMS, mmTron will be announcing a full IF to antenna solution for 25 to 29 GHz FWA, offering high EIRP for 400 MHz, 1024-QAM systems. Discussing mmTron’s unique approach to optimizing power, linearity and efficiency, Michael Roberg, mmTron Engineering Fellow, will be presenting an invited keynote, “GaAs & GaN MMIC Power Amplifier and Front-End Module Design for K-Ka Band Commercial Communication Systems” on Wednesday, June 19 (session We1C-1).

Naprotek, LLC

Naprotek will showcase its advanced electronics manufacturing capabilities at booth #2105. “Naprotek has been growing exponentially over the past few years, validating our complete solutions offering is truly resonating with our customer base,” stated Tim Filteau, COO of Naprotek. “We are excited to have our leadership team connect with existing and potential customers and industry press at IMS, where we can showcase our manufacturing capabilities in RF and microwave technologies.”

Complementing Naprotek’s core offerings in printed circuit board assembly and box build, SemiGen combines a deep technical expertise in RF/Microwave microelectronics manufacturing and test with a suite of build-to-print thin film and discrete semiconductor products, providing a full spectrum of advanced manufacturing capabilities. Manufacturing experts from both Naprotek and SemiGen will be available at the exhibition booth to discuss current and future programs with original equipment manufacturers. For those interested in a private meeting during the symposium to discuss their products, visit IMS 2024 in Washington, D.C., Booth #2105.

Pickering InterfacesPickering Interfaces

Pickering Interfaces will showcase its extensive range of RF and microwave switching, including SPDT, transfer, MUX and matrix switches with bandwidths from DC to 110 GHz, available in PXI, LXI and USB – as well as its new family of high channel count PXI/PXIe microwave multiplexer (MUX) modules – at booth 404 at IMS.

Pickering’s new high channel count microwave MUX family (models 40/42-788) is based on superior-quality Radiall mechanical microwave switches, with bandwidth options from 8 GHz to 40 GHz, and versatile switching configurations, including single or dual SP8T, SP10T or SP12T multiplexers. As well as microwave switching applications, the modules also suit many uses across the RF spectrum where extremely low insertion loss and ultra-high isolation are critical.

In addition to the new high channel count microwave MUX modules, Pickering will also highlight the following RF and microwave switching solutions:

  • MEMS-based PXI/PXIe RF multiplexers that deliver 300x operational life and 60x test system throughput compared to existing electro-mechanical relay products
  • 110 GHz PXI/PXIe microwave switch – supporting 5G and semiconductor test
  • A configurable PXI microwave switch platform that allows RF test engineers to combine a wide range of high-performance relay types while minimizing chassis slot usage
  • Microwave Design Tool – a free online tool for configuring flexible PXI & LXI microwave switch products
  • Flexible LXI microwave switch platform and turnkey services for LXI microwave switch and signal routing subsystems – including an LXI microwave switching matrix demo
  • A selection from Pickering’s broad portfolio of other switching and sensor simulation products, along with its PXI, PXIe and LXI/USB modular chassis and supporting cables and connectors.

pSemi psemi

Join pSemi at IMS International Microwave Week booth 1351 to explore the latest PE562212 multi-protocol IoT front-end module. Also, a live demonstration of the PE562212 will be showcased on the Nordic nRF52840 development board. 

Quantic® Electronics

Quantic® Electronics, a portfolio company of Arcline Investment Management, recently completed the acquisition of M-Wave Design, a leading supplier of ferrite-based RF and microwave components for aerospace, defense and quantum computing applications. M-Wave will be featured in Quantic Electronics’ booth #1251 at IMS2024.

Reactel 

Stop by booth 814 to see Reactel's full line of application-specific filters, multiplexers and multifunction assemblies up to 67 GHz. Get a chance to speak with the Reactel team, including Ray Hashemi, Engineering Manager, and Jim Assurian, Business Development Engineer, and author of the well-read Maryland Filter Guy blog. Along with learning about their latest filter innovations, enter the Get Pantsed contest and qualify to win a bevy of Maryland-themed items. Also, pick up the new Short Form Catalog for an overview of their extensive filter portfolio. Bandpass, lowpass, highpass and notch filters are available in an array of topologies such as tubular, LC, cavity, waveguide, ceramic and suspended substrate. Application specific multiplexer and multifunction assemblies are available as well. 

Remtec

Remtec Incorporated recently completed its new, 55,000 sq. ft. facility in Canton, Mass. New capabilities that directly result from the move are: increased capacity and processing speeds for Remtec’s existing proprietary solutions; advanced dicing and laser trimming systems; photoimaging, laser etching, laser ablation and like systems; and an array of other new manufacturing infrastructure and process capabilities. Remtec will be at booth 2215. 

RF SPIN

Visit RF SPIN at booth 1149 to meet their antenna designer team and the owner of RF SPIN, and explore the entire range of cutting-edge antenna solutions, including their new patented lens antennas. A team of experts will be available to provide detailed insights into their technologies and answer any questions you may have. RF SPIN recently launched its groundbreaking lens antenna product line. The line features three dual-polarized and four single-polarized lens antennas, operating across a broad frequency range of 730 MHz to 40 GHz. The patented 3D-printed lens technology allows these antennas to achieve an unprecedented increase in antenna gain of up to 6 dB.

Rohde & Schwarz

Rohde & Schwarz invites visitors to explore RF and microwave testing solutions at the Rohde & Schwarz interactive Measurement Playground in booth #1521. Trade show attendees will learn to work with versatile instruments that adapt to customers’ evolving needs. Rohde & Schwarz is excited to display a range of both new and familiar products on the IMS show floor this year. The updated R&S SMW200A vector signal generator features a sleek design, enhanced performance and unparalleled flexibility to meet the most demanding EVM requirements. Additionally, Rohde & Schwarz will be presenting the new R&S SMB100B RF and microwave signal generator, which delivers outstanding spectral purity and impressive output power, reaching up to 40 GHz. 

Rohde & Schwarz will also present a demonstration of the characterization of the TX/RX multi-antenna chip (CHARM) operating at up to 140 GHz using the D-Band OTA test solution.

Samtec 

SamtecAt IMS 2024, Samtec is introducing its newest phase and amplitude stable Nitrowave™ cable assemblies. Demos in the Samtec booth and in partner booths across the show floor will include Samtec’s LL043 43.5 GHz and LL071 71 GHz microwave cables in their distinctive orange color.  Another live demonstration features the newly available BE90A (rated to 90+ GHz), the latest product in the popular Samtec Bulls Eye® high performance test assembly series that features a high-density space-saving design for use on smaller evaluation boards with shorter trace lengths.

Samtec’s ganged Magnum RF® product, featuring industry leading density and novel configurations, will be shown in support of mmWave applications. Samtec has also released a new line of RF edge launch connectors spanning DC to 67 GHz with a narrow body design that is 33 percent smaller than traditional edge launch connectors. Interface types include 1.85 mm, 2.40 mm, and 2.92 mm. S

On Thursday, join Samtec engineer Kiana Montes for “Use An Array When A Standard PCB Connector Won’t Do,” on Thursday, June 20, from 11:15 – 11:30 am, at the MicroApps Theater in booth 2159.

StratEdge Corporation 

StratEdge will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in booth 515 at IMS. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as GaN, GaAs and SiC. These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive and down-hole.

Teledyne-e2v.jpg

Teledyne e2v

Teledyne will display the EV10AS940, a 10-bit Ka-band capable single channel analog-to-digital converter allows a sampling rate up to 12.8 GSPS. It features digital down-conversion and frequency hopping capabilities with multiple digital channels thanks to the integration of multiple NCOs. The EV10AS940 is packaged with an organic substrate to allow high speed and high bandwidth operations. 

Tektronix 

At booth 2205, Tektronix will showcase demonstrations of several cutting-edge technologies. This includes viewing the complex environments created in the Tektronix Arbitrary Waveform Generator and using SignalVu-PC with the Tektronix 6 Series B oscilloscope, which delivers the functionality of a vector signal analyzer.

times-ims24 preshow.jpgTimes Microwave

Experience unparalleled power and precision with Times Microwave Systems' High Power product lineup. Their StripFlex®, HPL, HP and HPQD™/MPQD™ connectors redefine connectivity, offering unmatched performance and durability for any application. StripFlex® provides exceptional flexibility without compromising performance, while HPL ensures reliability and efficiency in power distribution systems. HP connectors deliver robust connections for high-power applications, and HPQD/MPQD connectors offer quick-disconnect functionality and versatility. 

TransEON Inc.

TransEON will unveil a new MOSFET-based GaN-on-SiC process at IMS2024. The new process enables fabrication of cutting-edge transistors and MMICs with significant benefits over existing GaN HEMT technology. An official launch event will take place at the Marriott Marquis Independence Salon D at 1 PM on Tuesday June 18, directly accessible from the Walter E. Washington Convention Center Concourse (Level C). Pre-registration is required and can be completed online. Staff will also be present at Booth 2343 on the trade show floor.

Transline Technology

Transline Technology will showcase its unique proficiency in manufacturing metal-backed PCBs at IMS. These type of PCBs offer superior thermal performance and reliability, which cater to the evolving demands of high frequency applications in industries such as telecommunications, aerospace, defense, and beyond. Attendees visiting booth #733 will have the opportunity to engage with Transline's team of experts, who will provide insights into the company's capabilities and discuss how their metal-backed PCBs can address specific project requirements.

WAVEPIA 

WAVEPIA announced their participation in IMS 2024 in booth #851. They will showcase a range of new products, including GaN MMIC PA, FEM and LNA solutions from low to Ka-Band. They look forward to engaging with customers and business partners.

WIN Semiconductors

WIN Semiconductors will be showcasing its compound semiconductor RF and mmWave solutions in booth 531 at IMS. WIN recently expanded its portfolio of RF GaN technologies with the beta release of a highly robust mmWave GaN on SiC technology, NP12-0B.Core to this platform is a 0.12 μm gate RF GaN HEMT technology incorporating multiple refinements to enhance DC and RF ruggedness and add die-level moisture resistance. NP12-0B integrates multiple transistor improvements providing high ruggedness when operated in deep – saturation/high-compression pulsed and CW conditions. This new rugged technology eliminates the pulse droop behavior observed in GaN HEMT power amplifiers thereby improving the range and sensitivity of pulsed-mode radar systems. Additionally, NP12 – 0B is available with the Enhanced Moisture Ruggedness option and provides excellent humidity resistance when used in plastic packages.

Supporting full MMICs, the NP12-0B platform allows customers to develop compact pulsed or CW saturated power amplifiers for applications through 50 GHz. This process is qualified for 28 V operation, and in the 29 GHz band generates saturated output power of 4.5 watts/mm with 12 dB linear gain and over 40 percent power-added efficiency. The NP12-0B technology is ideal for rugged pulsed-mode high power amplifiers used in advanced radar systems.

 NP12-0B has reached beta release and is available for early access MPW runs. Qualification testing is complete and final modeling/PDK generation is expected to conclude in August 2024 with full production release scheduled for late Q3 ’24.