Welcome to Microwave Journal's Online Show Daily coverage of the IEEE MTT-S International Microwave Symposium 2024 in Washington, DC, 16-21 June. Our coverage includes exclusive content from conference organizers, exhibitors, the latest product releases, social media, May show issue technical articles and analysis from our editors.
May 2024 Show Issue Feature Articles
Full-Vehicle OTA Testing at the Core of the Connected Car (R)EVOLUTION
IMS2024 General Chairs’ Welcome
2024 Spring/Summer ARFTG Microwave Measurement Conference
IMS2024 Exhibition
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IMS Executive Forum: A&D Semiconductor to Systems Trends
Tuesday, 18 June 2024, 16:00-17:00, MicroApps Theater, Booth 2159
This panel of RF/microwave device and system company executives will discuss current trends in semiconductor technology and how they affect system design and performance. New types of compound semiconductor technology, AI integration, heterogeneous integration, chiplets, 3D packaging, new thermal materials and other related topics will be discussed including how these advancements affect system architecture and improve SWaP-C.
Moderator: Sanjay Raman, Dean of Engineering, University of Massachusetts Amherst
Panelists: Nick Kolias, Principal Engineering Fellow, Raytheon
Tim Lee, Technical Fellow, Boeing
Bryan Goldstein, President, Analog Devices Federal, Vice President, Aerospace and Defense Group, Analog Devices
Tom Kole, Vice President of Sales and Marketing, Integra Technologies
Dean White, Director- Defense and Aerospace Market Strategy, Qorvo
Sponsored By:
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IMS2024 Industry News
More IMS2024 News and Articles
Video
Microwave Journal editors Pat Hindle and Eric Higham cover the May IMS & 5G/6G themed issue including a groundbreaking article on Waste Factor, interview covering CATV with Mini-Circuits, industry news and IMS 2024 preview.
Microwave Journal editors Pat Hindle and Eric Higham cover the May IMS/5G-6G issue special focus articles, ADI interview on wideband digitizers, IMS 2024 exhibition and industry news.
Podcast