Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium (IMS), San Diego, Calif., June 11–16.
Indium Corporation is a leading solder supplier for laser and optical applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion and oxidation-resistant solder joint possible.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- Highly accurate thickness control
- Precision edge quality, virtually burr-free
- Optimized cleanliness control
- Default waffle-pack method.
Indium Corporation’s Au PDA preforms are available in the following alloys:
- 80Au20Sn, 79Au21Sn, 78Au22Sn, 75Au25Sn
- 88Au12Ge
- 82Au18In
- 96.8Au3.2Si.
Indium Corporation’s AuLTRA™ 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA™ 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition, and improving wetting and voiding. The AuLTRA™ product line also comes in 78Au22Sn and 79Au21Sn compositions.