Kulicke & Soffa Industries Inc. announced the signing of an agreement to acquire Alphasem, a supplier of die bonder equipment, from Dover Technologies International Inc., a subsidiary of Dover Corp. The purchase price is $30 M, subject to a working capital adjustment. The acquisition is expected to close on or about November 3, 2006, and is subject to customary closing conditions.
"The acquisition of Alphasem is a natural extension of K&S’s core equipment business into die bonding equipment," said K&S equipment segment vice president, Christian Rheault. "The die bonding process precedes the wire bonding step in semiconductor chip manufacturing, and normally utilizes adjacent floor space and a common engineering team. This supplier consolidation will enhance our ability to provide solutions to our customers across a greater span of the semiconductor assembly process. According to VLSI Research, the die bonder market was $520 M in calendar year 2005. The Alphasem team has good market presence, provides strong engineering and process expertise, and has demonstrated a long standing commitment to the die bonder market. The combined Alphasem/K&S organization will allow us to better serve our customers’ needs while further expanding our overall semiconductor assembly equipment market presence."
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