Rogers Corp. introduced its new RO4450B™-dx Bondply, a high fill/flow version of the RO4450B high frequency circuit material, at last week's European Microwave Week.
RO4450B circuit material is a glass-reinforced hydrocarbon/ceramic thermoset bondply designed for performance-sensitive, multilayer printed circuit boards. These bondplys are designed to offer superior high frequency performance and low cost circuit fabrication. The result is low loss material, which can be fabricated using standard epoxy/glass (FR4) processes. The new RO4450-dx is a high fill/flow version of the RO4450B bondply. It is designed to fill those high density designs while still offering thin dielectric spacing.
RO4403™, RO4450B™ and RO4450B™-dx prepregs are based upon the RO4000 series core materials and are compatible in multilayer constructions with either RO4003C or RO4350B laminates. As with RO4000 laminates, RO4400 prepregs are compatible with the majority of standard FR4 processing practices.