Gel-Pak; a Delphon company and worldwide leader in protective carriers for semiconductor, optoelectronic and medical devices; will showcase its new Lid Clip Super System LCS2™, Polyurethane Device Carrier and Texturized Film JEDEC Carrier at the International Microwave Symposium (IMS) in Denver, Colo., June 21-23, 2022.
Craig Blanchette, senior process engineer at BAE Systems, will present the innovative new LCS2 during the event’s Microapp session on Tuesday, June 21 at 1:45 pm. Developed in partnership BAE Systems, the new lid/clip system prevents thin semiconductor die from migrating out of the pockets of waffle pack/chip trays during shipping and handling. Gel-Pak’s new Polyurethane Device Carriers look and function similar to the market-leading Gel-Box, Gel-Tray and Vacuum Release Tray products, but with an alternative elastomer technology. The proprietary polyurethane material is both static dissipative and non-silicone.
The Textured Film JEDEC Carrier, based on a reversible adhesion technology known as the Gecko effect, uses microstructures to securely hold components in place during shipping and handling. The film is ideal for in-process device handling and for shipping of packaged components. The product is available in sheet and roll format and will be showcased laminated to a JEDEC carrier.