Theory and Design of Microwave Filters
Ian C. Hunter
The Institution of Electrical Engineers
353 pages; $89
ISBN: 0-85296-777-2
Microwave filters are important components used in many RF and microwave systems, such as cellular radios, satellite communications and radar. The classic treatise on microwave filters and couplers by Matthaei, Young and Jones, published 36 years ago, is still widely used but has never been revised. This book includes other filter types and design theories which did not exist then.
"The purpose of this book is to provide a single source for filter design..."
The purpose of this book is to provide a single source for filter design, which includes basic circuit theory, network synthesis, and the design of a variety of microwave filter structures. The philosophy throughout the book is to present design theories, followed by specific examples with numerical simulations of the designs. Where possible, examples of real devices have been used to illustrate the theory. The book is aimed at final year undergraduates, and MSc and PhD students. It should also form a useful reference for research workers and engineers who are designing and/or specifying filters for commercial systems. The author makes extensive use of mathematics throughout the book.
After an introduction showing applications and realizations of RF and microwave filters, Chapter 2 is devoted to basic network theory, covering linear passive time-invariant networks, loss less networks, ladder networks, synthesis and analysis of two-port networks, and other types of analysis. Chapter 3 is dedicated to the designs of lumped low pass prototype networks. Chapter 4 covers circuit transformations of lumped prototype networks, including impedance transformations and practical procedures for measurements of the different couplings and Q-factors of the resonators. TEM transmission line filters are the subjects of Chapter 5. Broadband TEM filters with generalized Chebyshev characteristics, parallel-coupled transmission lines, interdigital filters, combine filters and narrow band coaxial resonator filters are described. Chapter 6 is dedicated to waveguide filters and Chapter 7 to dielectric resonator filters. Chapter 8 describes miniaturization techniques for microwave filters, including super conducting filters, surface acoustic wave filters and active microwave filters.
To order this book, contact: The Institution of Electrical Engineers, c/o Whitehurst & Clark, 100 Newfield Ave., Edison, NJ 08837 (888) 438-2517; or PO Box 96, Stevenage, Herts SG1 2SD, UK +44 1438 313311.
RF Measurements of Die and Packages
Scott A. Wartenberg
Artech House Inc.
224 pages; $89, £62
ISBN: 1-58053-273-x
Accurate RF measurements are an important phase in the design and development of RFIC and MMIC circuits. The goal of this book is to provide the reader with methods and procedures to perform better RF measurements. It is based principally on the use of vector network analyzers (VNA) and explains how to use coplanar probes and test fixtures to characterize the circuits.
"The goal of this book is to provide the reader with methods and procedures to perform better RF measurements."
Chapter 1 introduces the topics covered subsequently and details the essential elements in an RF test system: the interface between the system and device under test (DUT), VNA and connecting cables. Chapter 2 explains the errors found in an RF test system and how they can be mathematically removed by applying error models. Chapter 3 discusses the construction and RF characteristics of coplanar probes. Chapter 4 describes a typical high volume test setup, focusing on the membrane probe. Typically, the final product is not a bare die but one that has been wire-bonded and packaged. Chapter 5 covers how to design an RF test fixture. In particular, it discusses the parasitic effects of the fixture on the DUT as well as a detailed discussion of how to design RF transitions in the fixture. The often-challenging task of calibrating a test fixture is also included. Chapter 6 explains how to use RF coplanar probes to measure die on the wafer. This chapter centers on how to de-embed the effects of the probe pads and interconnects leading to the DUT. Moving beyond the DUT to coplanar probe interface, Chapter 7 describes the rest of the RF test systems, including a noise measurement system, a high power RF test system and a thermal (hot and cold) measurement system. Chapter 8 explores package-testing, breaking the test fixture down section-by-section and explaining the RF aspects of its design. It also covers techniques on how to characterize packages, both empty and with the die mounted inside. Finally, Chapter 9 looks at future trends in the characterization of RF and microwave circuits.
To order this book, contact: Artech House Inc., 685 Canton St., Norwood, MA 02062 (781) 769-9750 ext. 4002; or 46 Gillingham St., London SW1V 1HH, UK +44 (0) 207 596-8750.