This eBook addresses many design issues with PCBs for high power GaN devices, higher frequency mmWave circuits, thermal expansion effects, heat sinking, extending operating temperatures, reducing circuit size, copper surface roughness effects, interface materials and connector launch methods. The first two articles deal with high power GaN devices addressing some of the design challenges for high voltage and high frequency designs. The next article looks at PCB materials to reduce circuit size and the one after addresses thermal power handling in space applications. The next article looks at environmental effects on circuit performance and how to test them while the last two articles address designing PCB mmWave circuits including amplifiers.
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