Workshops & Courses
Advanced RF Power Amplifier Techniques
Topics: Theory and design of RF power amplifiers, both for mobile and basestation applications in modern communications systems. In-depth treatment of PA design, PA modes, envelope power management and linearization techniques.
Site: Nice, France
Dates: February 11-14, 2002
Contact: CEI-Europe, PO Box 910, S-612 25 Finspong, Sweden +46 122 175 70, fax +46 122 143 47 or e-mail: cei@cei.se.
Far-field, Compact and Near-field Antenna Measurement Techniques
Topics: The necessary theory, basic principles of operation, measurement procedures and obtainable accuracy for the most common antenna measurement techniques in use today.
Site: Nice, France
Dates: February 11-15, 2002
Contact: CEI-Europe, PO Box 910, S-612 25 Finspong, Sweden +46 122 175 70, fax +46 122 143 47 or e-mail: cei@cei.se.
RF and High Speed Digital Design Using Field-solvers
Topics: Applying commercial field-solver software to a variety of RF and high speed digital design problems. The emphasis is on choosing the right CAD package for the job and applying it intelligently.
Site: Nice, France
Dates: February 18-20, 2002
Contact: CEI-Europe, PO Box 910, S-612 25 Finspong, Sweden +46 122 175 70, fax +46 122 143 47 or e-mail: cei@cei.se.
Linear and Nonlinear RF Radio Components and Design
Topics: The design of components within the context of the overall system. The principal focus is on retaining simple linear and quasilinear techniques to efficiently and intuitively design systems and components.
Site: Nice, France
Dates: February 18-22, 2002
Contact: CEI-Europe, PO Box 910, S-612 25 Finspong, Sweden +46 122 175 70, fax +46 122 143 47 or e-mail: cei@cei.se.
International Workshop on Wafer Level CSP and Flip Chip Packaging
Topics: Wafer level packaging materials and processes, wafer level burn-in and test, small die and memory products, ultra-high density substrate technologies for WLP, new and advanced wafer technologies, wafer package reliability.
Site: Stone Mountain, GA
Dates: March 1-3, 2002
Contact: Rao Tummala, Georgia Institute of Technology, e-mail: rao.tummala@ee.gatech.edu.
Wideband CDMA for UMTS/UTRA
Topics: This course will cover principles, technologies, system architectures, standards, main applications and expected future trends in the field. Emphasis will be on applications in personal, indoor and the third generation of land and satellite mobile radio communications.
Site: Davos, Switzerland
Dates: March 11-15, 2002
Contact: CEI-Europe, PO Box 910, S-612 25 Finspong, Sweden +46 1222 175 70 or e-mail cei@cei.se.
Application Specific Integrated Circuits
Topics: This course provides everything one must do to begin, understand and complete the design of an electronic system containing modern deep submicron ASICs.
Site: Davos, Switzerland
Dates: March 18-22, 2002
Contact: CEI-Europe, PO Box 910, S-612 25 Finspong, Sweden +46 1222 175 70 or e-mail cei@cei.se.
Advanced Technology Workshop on Passive Integration
Topics: Design, simulation and libraries, material systems, fabrication of passive elements in component platforms, capacitors, connectors, diodes, flex circuits, ferrites, inductors, resistors, thermistors and varistors.
Site: Oqunquit, ME
Dates: June 19-21, 2002
Contact: Robert Hestand, AVX Corp. (843) 444-2886, fax (843) 448-2106 or e-mail: hestand@avxus.com.