Rogers Corporation’s Advanced Connectivity Solutions team will be presenting the latest developments in printed circuit board (PCB) materials for emerging high frequency applications at the upcoming IPC APEX EXPO 2018, February 27–March 1, 2018 at the San Diego Convention Center.

 As part of the technical program, Rogers’ Technical Marketing Manager, John Coonrod, is scheduled to present “Practical Considerations for PCB Impedance Measurements” on Wednesday, February 28, from 1:30 to 3:00 PM as part of the technical conference session S16: PCB Signal Integrity/High Speed/ High Frequency.

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Rogers at Booth 500

On the exhibition floor, Rogers’ technical team will be at Booth #500 with examples of their diverse circuit materials as well as guidance and advice on achieving optimum performance with materials such as RO4460G2™ bondply and RO4730G30™ laminates.

Rogers recently introduced RO4460G2 low loss bondply with a 6.15 Dk. RO4000® thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers’ high frequency and high speed digital materials where operating frequency, dielectric constant or high speed signal requirements dictate the need for high performance materials. The introduction of RO4460G2 bondply now provides designers a 0.004 in. (0.101 mm) bonding layer that complements the RO4360G2™ low loss, glass-reinforced 6.15 Dk copper clad thermoset laminates.

RO4460G2 bondply exhibits excellent Dk control for repeatable electrical performance, a low z-axis expansion for plated through hole reliability and thermoset bond temperatures compatible with standard epoxy/glass (FR-4) processes. RO4460G2 bondply is an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4400™ bondplies are capable of withstanding multiple lamination cycles. Each of the RO4400 bondplies have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.

Thinner core options are available for RO4730G3 laminates. In 2016 Rogers launched RO4730G3 UL 94 V-0 antenna grade laminates, which combines a flame retardant, low loss thermoset dielectric with patented LoPro® copper foil and incorporates a proprietary filler system that brings to market a material solution that addresses many of today’s challenges. As we’ve witnessed antennas developed for 4G (LTE-Advanced) and beyond (5G) becoming more complex, there has been further desire by antenna designers for thinner core constructions, and in 2017 Rogers qualified additional 5 and 10 mil thickness options. RO4730G3 laminates bring to market a flame retardant material that has a Dk match to 3, Df of 0.0023 (2.5 GHz), low z-axis CTE for plated through hole reliability, low density microspheres yielding a laminate 30 percent lighter than PTFE products and compatibility with conventional epoxy and high temperature lead-free solder processing. With the right combination of materials, RO4730G3 laminates provide an optimum blend of price, performance and durability.

These are just a couple of examples of Rogers’ circuit materials lineup, with more on display at Rogers’ Booth #500 at the upcoming IPC APEX EXPO 2018. Visitors can learn more about the benefits of each material along with application assistance at the Rogers’ booth.