We arrived in San Francisco from all directions, crossing the Golden Gate, driving up from Silicon Valley, flying in to SFO. Perhaps some even came by ferry from around the Bay. San Francisco is a city that captures the spirit, the juxtaposition of hills, ocean and a Mediterranean climate with 240 years of settlement leading to the most modern wireless and internet technology. No wonder this city is a favorite locale for the International Microwave Symposium (IMS), always drawing record crowds.

If you’ve attended more than a few times, you probably sense that this annual event is actually three parallel universes: several technical conferences that explore the leading edges of microwave technology, an exhibition where companies showcase the products that fuel the industry and, perhaps most importantly, a reunion. Ours is such a small industry that the colleagues we meet in the early years of our careers become friends, even though our company names change. IMS is an anchor where we see friendly faces and catch up on each others’ lives.

IMS — more accurately called Microwave Week — went by in a blur, beginning with workshops and the RFIC Symposium, through the IMS technical sessions and exhibition and ending with more workshops and the ARFTG conference on Friday. Millimeter wave applications were widely covered at the conferences taking over amplifier design for handsets as the most prevalent topic. Other popular topics, of course, were 5G and IoT as those areas have taken a large mindshare over the past year or two in our industry as primary areas for future growth. The NewSpace/Commercial Satellite and RF Energy market are also popular topics as they promise to grow significantly in the near future. Over 600 companies exhibited, from 3D Glass Solutions to Zik and all the companies that have anchored IMS for years. It was impossible for Microwave Journal to visit each of the firms that filled Moscone Center, but we did our best. The following summarizes what we saw and learned during the three very hectic days of the exhibition.

Software/EDA

Altair has completed the acquisition of CEDRAT S.A. and its New York-based wholly-owned subsidiary, Magsoft Corporation, expanding the electromagnetic and thermal simulation capabilities of its HyperWorks® CAE portfolio. With over 35 years of experience in electrical engineering, CEDRAT is a leader in the field of simulating low frequency electromagnetics for electric motor design. Based in Grenoble, France, they are a top tier technology company in the electromagnetics software space, developing and applying simulation software used by manufacturers to accelerate the development of reliable and optimized solutions for electric and electromagnetic devices such as motors, transformers, actuators, sensors, heat treatment processes, transmission lines, EMC, arc chambers and superconductivity applications.

ANSYS was demonstrating the new automated antenna design workflow in ANSYS HFSS streamlines synthesis, set-up and analysis of antenna designs. This enables engineers, including those without antenna expertise, to create and optimize antenna designs and integration. Products demonstrated include ANSYS HFSS, ANSYS Savant and ANSYS EMIT. The ability to share accurate design data among engineering groups while protecting IP is critical in today's environment. The new patent-pending 3-D EM component in ANSYS HFSS is a breakthrough in model sharing, allowing engineers to create encrypted, password-protected user-models that provide all the information to successfully design RF and microwave components in high-frequency networks. ANSYS now provides a complete flow to address electrical, thermal, and structural reliability in high-frequency systems. This new RF design flow supports high-frequency design from layout, inclusion of signal integrity, power integrity, EMI, 3-D integration and thermal and structural reliability.

The latest release of an NI/AWR Connected solution is for ANSYS, Inc.’s High Frequency Electromagnetic Field Simulation (HFSS) software. This flow utilizes EM Socket II to enable bi-directional interoperability between Microwave Office and HFSS and expands upon the prior offering by allowing designers to define an HFSS 3D layered structure, seamlessly launch an HFSS simulation and embed S-parameter results directly back into Microwave Office without leaving the software environment.  Additionally, Sonnet Software and Computer Simulation Technology (CST) have upgraded from prior EM Socket implementations to this new format.  For Sonnet, the new flow brings expanded capabilities that includes 64-bit compatibility, as well as the ability to run 2D planar EM simulations asynchronously.  For CST STUDIO SUITE, this new implementation automates the round-trip flow in much the same way as that of HFSS but also allows for arbitrary 3D layout data to be passed, thereby minimizing user time by eliminating manual intervention.

Computer Simulation Technology announced the newest release of CST STUDIO SUITE – Student Edition, a special free version of its flagship electromagnetic simulation package especially for students. This release adds a low-frequency solver especially suitable for learning about eddy currents. The Student Edition contains the versatile time domain, frequency domain and static and thermal solvers, and is supported by a set of online examples showing how classic textbook problems can be solved with simulation. The software can be incorporated into the coursework for a class, but the online examples mean that it can also be used by individual students for independent extracurricular learning at both undergraduate and postgraduate level.

The company also unveiled its upcoming Conjugate Heat Transfer (CHT) solver of CST STUDIO SUITE, which offers accurate thermal and air flow simulations for electromagnetic systems. Heating is an important consideration for many high-power applications and compact electronic systems. Excess heat can damage components and cause thermal expansion that detunes sensitive components. Natural convection and fan cooling can significantly affect how a component heats up, which makes understanding the air flow through and around a device a key part of multiphysics design.

COMSOL announced support for app development that furthers work toward 5G and the IoT with several demonstrations. The latest release of the RF Module in COMSOL Multiphysics® comes with several application examples that allow COMSOL® software users to run, inspect, and use the apps – allowing them to see how straightforward it is to turn their model into a custom application. Of interest to antenna designers is the Slot-Coupled Microstrip Patch Antenna Array Synthesizer demo app. It simulates an FEM model of a device that is fabricated on a multilayered low temperature co-fired ceramic (LTCC) substrate, and extends the results to the user-specified array configuration. The results include S-parameter, electric field distribution on each layer, far-field radiation pattern of the antenna array, and its directivity. The far-field radiation pattern is calculated by multiplying the array factor and the single antenna radiation pattern to perform an efficient far-field analysis without simulating a complicated full array model, allowing the app user to independently obtain their simulation results within seconds. The upcoming version of the RF Module, which is scheduled to be released shortly after IMS2016, strengthens its design and test feasibility by including new tutorial models such as a log-periodic antenna for EMI/EMC Testing, and a signal integrity (SI) and time-domain reflectometry (TDR) analysis of adjacent microstrip lines. The Application Libraries also include detailed model examples guiding users to perform very fast prototyping with high accuracy through reduced-order model simulation techniques based on asymptotic waveform evaluation (AWE) and frequency-domain modal methods.

IMST previewed Version 7.5 of its EMPIRE XPU 3D electromagnetic field simulators, which will be launched early in Q3 of 2016. The simulator is based on the powerful Finite Difference Time Domain method (FDTD), and with its unique adaptive on-the-fly code generation it exhibits very fast simulation. EMPIRE XPU’s applicability ranges from analyzing planar, multi-layered and conformal circuits, components and antennas to multi-pin packages, waveguides, and SI/EMC problems including the device’s operational environment. The new version will feature a new user interface and key features that will ease and speed up simulation.

Keysight Technologies and Georgia Tech announced a plan to launch a Keysight software development center to accelerate Keysight’s transformation into a software-centric solutions provider. Keysight has chartered the center to develop next-generation software for use in the design and test of electronic products being created by Keysight’s customers around the world. The new facility will grow to house more than 200 software developers over the next five years. Located in Atlanta’s growing Midtown district, the center will feature an open environment that fosters collaboration and supports an agile software development approach. With its proximity to Georgia Tech, Keysight’s center will have access to leading research, top students and state-of-the-art engineering laboratories. Todd Cutler, vice president and general manager, Keysight Software Products Organization (SPO) and EEsof Electronic Design Automation, will relocate from Santa Rosa to Atlanta to lead the new software development center.

Keysight Technologies also recently introduced the W1720EP Phased Array Beamforming Kit, a new add-on software simulation personality for the SystemVue 2016.08 design environment. The software enables researchers and system architects working on platforms using beamforming algorithms for 5G, satellite, NewSpace, radar and EW applications, to reduce interference and power consumption, while increasing physical range. By incorporating MathWorks' MATLAB Script, SystemVue seamlessly integrates existing algorithms and extends array design tools to the RF and system design communities. This allows system modelers to explore realistic performance of baseband and RF beamforming architectures to save cost and complexity, and streamlines R&D design efficiency across disciplines.

Sonnet release 16 expands the Sonnet Professional feature set to facilitate more freedom, flexibility, and optimum results for design projects. The automation and integration with third party EDA vendors leads to more accuracy in circuit designs, all with increased efficiency. It has been designed to better incorporate internal models from other sources into current geometry with its Model Components feature. Users can place models in the geometry from a source library containing purchases and in-house model designs.

MathWorks announced capabilities to strengthen design support for digitally-assisted RF MIMO systems. Updates to RF Toolbox, SimRF and Antenna Toolbox in Release 2016a will help engineers ramp-up on RF simulation, assist in performing a first order RF budget analysis that is extendable with advanced models and help integrate the results of RF design in system-level simulation. The introduction of RF Budget Analyzer in RF Toolbox helps engineers design RF front-ends, focusing on getting started with RF modeling and simulation. This helps teams efficiently iterate between system-level specifications and implementation of architectural designs, and reduces time spent in debugging validation test benches. Engineers can now rapidly build executable specifications of the RF front-end and integrate the results of RF design into a system-level simulation. Antenna Toolbox helps to rapidly model, design, analyze and visualize real-life antennas and antenna arrays, including dielectric substrate and custom geometries. Engineers can now perform a first-order design in MATLAB with immediate insights and automation, reducing time spent in assessing suitability for the desired application.

Modelithics recently released a new version of The Modelithics® COMPLETE Library, version 16.0, formatted for use with Keysight EEsof EDA Advanced Design System (ADS) simulation software from Keysight Technologies. With this release, which follows version 12.0, the version number now corresponds with the current year. The Modelithics COMPLETE Library v16.0 adds 56 NEW MODELS to the already extensive collection of powerful, advanced-feature simulation models. Passive component Microwave Global Models™ that have been added include AVX and ATC capacitor, inductor and resistor models, Coilcraft and Würth Elektronik inductor models, Vishay and TDK capacitor models, a Piconics conical inductor model, and ferrite bead models from Murata and Würth Elektronik. New non-linear active device models are available for CEL (NEC) and Qorvo (formerly RFMD) transistors. System-level component models have been added for ATC, AVX, and API Inmet attenuators, AVX couplers and diplexers, and new package models from Barry Industries and RJR Polymers. Single substrate S-parameter models are also now available for three IPDiA broadband capacitors. Please see the release notes for more details on new models and new features.

The WASP-NET EM CAD optimization tool from Microwave Innovation Group (MiG) offers extremely high EM optimization speed based on the hybridization of eight EM solvers. This hybrid domain-composition technology intelligently combines different methods for one and the same structure. Recent advances include a powerful user-friendly graphical 3D editor, which not only enables users to intuitively set up arbitrary user-defined microwave structures and antennas but also to import already available structures in standard 3D CAD formats, to deconstruct and parameterize them for fast optimization.

A new advanced fast integral equation solver technique based on a hybrid shooting-and-bouncing-ray (SBR), physical theory of diffraction (PTD), method-of-moment (MoM) technique completes WASP-NET’s hybrid mode-matching/multi-solver EM CAD tool for efficiently optimizing large antenna structures (e.g. multiple large reflectors and mirrors) including complete feed-networks.

Test and Measurement

Anritsu recently introduced an E-Band frequency option to the MS46522B and MS46524B series of Performance ShockLine™ Vector Network Analyzers (VNAs) that provides manufacturers of passive E-Band devices, such as antennas, filters and duplexers, with high quality measurements at a more affordable price than previously available alternatives. The new ShockLine E-Band option utilizes Anritsu’s NLTL technology complemented with novel monolithic broadband directional bridges, multiplexers, and other key components, resulting in NLTL-based samplers and distributed harmonic generators that provide outstanding performance and a lower price than alternative approaches. For example, ShockLine performance enables filter manufacturers to take advantage of 120 dB of dynamic range to meet higher selectivity requirements. In addition, the same NLTL-based technology is also inherently temperature and time stable, which results in less drift and down time needed for performing calibrations. Less down time means higher utilization and lower cost of test.

Copper Mountain and Farran Technology partnered to create CobaltFx, a new piece of technology for millimeter-wave S-parameter measurements that establishes lab quality results in a more compact and significantly more affordable solution.  The system is the first millimeter-wave frequency extension solution built on a 9 GHz vector network analyzer (VNA) and is available in three dedicated waveguide bands: 50-75 GHz, 60-90 GHz and 75-110 GHz.  The system is anchored by a 9 GHz Vector Network Analyzer from Copper Mountain Technologies Cobalt Series. It features fast sweep speeds down to 10 microseconds per point and a dynamic range of up to 162 dB, all comprised in a compact USB form factor. C4209 works seamlessly and exclusively with Farran Technology’s millimeter-wave FEV frequency extenders.

National Instruments (NI) showed an interesting “wideband technology” demonstration in their booth that was based on a shrouded 9-slot PXI chassis and featured generation, analysis, and real-time processing of a radar chirp signal.  Although specific details about the products inside the chassis were not yet available, the LabVIEW front panel revealed that the chirp waveform occupied 500 MHz of bandwidth. “Technologies like 5G, radar, and DPD require increasingly wideband instruments,” said David Hall, NI’s Principal Marketing Manager.  “In addition, many of these applications also require increasingly sophisticated software to process signals in real-time.”  Hall also mentioned that a new product will be coming out later this year. Separately, NI was also demonstrating new PXI solutions for 802.11ax device testing and an evolution of their semiconductor test system (STS) product for RF front end module (FEM) manufacturing test.  The 802.11ax solution is one of the industry’s first, and the FEM test system is the only production test solution to NI’s knowledge that is capable of extracting and applying DPD models in real-time.

Rohde & Schwarz has expanded its portfolio of midrange signal and spectrum analyzers. The new R&S FSVA offers a 160 MHz analysis bandwidth over its entire frequency range. The instrument’s advanced features include an improved phase noise of typically –117 dBc at 1 GHz with 10 kHz offset, together with an improved third order intercept (TOI) for frequencies lower than 7 GHz, for a higher dynamic range. As a result, the R&S FSVA offers enhanced spectrum measurements compared with the current R&S FSV family, e.g. spectrum emission mask and ACLR under higher power conditions. The sensitivity of the preamplifier of typically –166 dBm for frequencies lower than 7 GHz has also been improved. Like the R&S FSV, the R&S FSVA is available in five models, covering frequency ranges from 10 Hz to 4 GHz, 7 GHz, 13.6 GHz, 30 GHz and 40 GHz. The R&S FSVA supports all R&S FSV hardware functions and firmware options and both are fully remote control compatible for use in complex test setups.

Virginia Diodes was featuring their Spectrum Analyzer Extension (SAX) modules provide high performance broadband down-conversion and frequency extension of microwave spectrum analyzers into the THz range. VDI SAX modules offer full waveguide band coverage and are available from WR15 (50 to 75 GHz) to WR1.0 (750 to 1100 GHz) with additional bands under development.  For spectrum analyzer extension mode, this turn-key, sweepable solution is compatible with most modern spectrum analyzers with external mixer option. For block down- and up-conversion, the SAX modules can be driven by an LO signal generator that meets the input frequency and power requirements.

Semiconductors/Components

Analog Devices (ADI) announced several new products at IMS. Arguably, the most impressive was the RadioVerse™ “technology and design ecosystem,” which provides customers with integrated transceivers, a robust design environment and market-specific technical expertise to quickly move radio designs from concept to creation. The new ecosystem’s transceiver technologies reduce size, weight and power (SWaP), while the design environment offers board support, software and tools to help customers simplify and accelerate radio development. RadioVerse is tailored to support applications such as wireless infrastructure, aerospace and defense sensors and T&M.  As part of the RadioVerse technology and design ecosystem release, ADI introduced the AD9371, the latest addition to the integrated wideband RF transceiver product series. It is a versatile, carrier-grade, system-on-chip radio solution that achieves a wide tuning range of 300 MHz to 6 GHz, 100 MHz signal bandwidth and power consumption of less than 5 W under standard operating conditions. It replaces or eliminates as many as 20 discrete radio components and can be used as a common design platform across multiple applications and standards, increasing R&D efficiency and reducing time-to-market. Other products in the wideband RF transceiver series include the AD9361 and AD9364. ADI also featured their 24 GHz radar transceiver, with four receive channels and two transmit channels. The system can be used as a sensor for automotive blind spot detection, traffic monitoring and stoplight control and other industrial applications. ADI and Escape Communications have partnered to create a reference design for a 10 Gbps E-Band link, which they demonstrated in ADI’s booth.

GLOBALFOUNDRIES announced a next-generation RF silicon solution for its SiGe high-performance technology portfolio. The technology is optimized for customers who need improved performance solutions for automotive radar, satellite communications, 5G millimeter-wave base stations and other wireless and wireline communication network applications. The SiGe 8XP technology is the latest extension to the company’s 130nm high-performance SiGe family and enables customers to develop RF solutions that deliver even faster data throughput, over greater distances, while consuming less power. The advanced technology offers an improved HBT performance with lower noise figure, higher signal integrity, and up to a 25 percent increase in maximum oscillation frequency (fmax) to 340 GHz compared to its predecessor, SiGe 8HP.

MACOM added new plastic-packaged, GaN MAGb power transistors that provide 320 W and 160 W output peak power with efficiency up to 79 percent with only fundamental tuning across the 400 MHz bandwidth– an improvement of up to 10 points compared to LDMOS. Linear gain is 20 dB maximum. These transistors provide a compelling alternative to ceramic-packaged devices without compromising RF performance or reliability. Thermal behavior is improved by 10 percent compared to ceramic-packaged MAGb offerings. These power transistors enable the implementation of a simple symmetric Doherty amplifier design while maintaining excellent RF performance, compared to lesser performing and complex asymmetric Doherty topologies imposed by LDMOS-based transistors. With MACOM’s MAGb series transistors, Doherty amplifiers show the same level of DPD friendliness as LDMOS-based solutions.

Mini-Circuits exhibited their full portfolio of products and featured a new line of test solutions. Combining hardware and software into a turn-key solution speeds development time, as customers only have to focus on product development — not test systems. These solutions are based on a building block approach, which allows many custom configurations to be delivered within two weeks. Systems can be configured as combinations of amplifiers, signal generators and signal routing and distribution. Applications include 3G and 4G base stations, satellite communications and RF burn-in systems. They also featured their absorptive/reflectionless filters from DC to 21 GHz. They prevent unwanted reflections in the stopband and are well suited for pairing with mixers, multipliers, signal sources and more.

Anticipating the eventual arrival of small cells, NXP introduced eight, 28 V LDMOS Doherty PAs, four symmetric and four asymmetric. These two-stage ICs cover 700 to 3800 MHz and provide 2.5 to 12 W output power, with gain ranging from 24 to 31 dB. NXP also launched four, 48 V GaN on SiC power transistors for Doherty PAs in cellular base stations. The four new devices collectively cover 1805 to 3600 MHz. For defense applications, NXP introduced six GaN on SiC transistors for driver and power amplifiers operating in the 1 MHz to 3 GHz band, with output power levels from 12 to 250 W. Their broadband coverage from HF to S-Band covers virtually all frequencies used by military radios or the lower frequency sections of defense systems. The company extended the power capability of the plastic package yet again, introducing a 1.5 kW LDMOS power transistor covering 1 to 500 MHz, for applications such as broadcast, CO2 lasers and MRI systems. NXP also featured a portable microwave oven designed for camping. Cylindrical and fairly small, like a camp lantern,  the oven uses a 250 W LDMOS PA to heat the food and is powered by a 12 V battery contained in the bottom of the unit; the battery lasts for about 30 minutes of cooking. The oven will be available at Bass Pro Shops and Cabela’s next year.

Peregrine Semiconductor introduced an 8 to 12 GHz beam former with 6-bit amplitude and phase control. The PE19601 MPAC–Beamforming solution integrates a digital step attenuator, a phase shifter, Rx/Tx switching and a digital serial interface on a single SOI die. Key specs are 44 dBm input IP3 and 50 dB isolation. Peregrine also introduced a Ku-Band image reject mixer that integrates two mixers, a local oscillator path 90-degree coupler and RF port baluns on a single die. Integrating these functions provides good image rejection, reduces LO leakage and improves the LO to RF isolation. This mixer operates with single-ended signals on the RF and LO ports, and it can be used as an up-conversion or down-conversion mixer. The RF frequency range is 10 to 19 GHz, the LO port covers 12 to 19 GHz and the IF port accepts broadband quadrature signals from DC to 4 GHz. The PE41901 achieves LO to RF isolation of 38 dB, LO to IF isolation of 23 dB and 21 dBm IIP3. The mixer has 10 dB conversion loss and achieves image rejection of 25 dB. No external blocking capacitors are required if 0 VDC is present on the LO or RF pins.

Qorvo introduced six, 50 V GaN power transistors for radar, avionics and communications. The devices operate up to 4 GHz with saturated output power from 10 to 125 W. For wireless infrastructure, the company displayed three GaN drivers and PAs, including an asymmetric Doherty designed for China Mobile's 2575 to 2635 MHz band. The PA provides 36 W average at 53 percent efficiency and 15.9 dB gain. For indoor small cells and distributed amplifier systems (DAS), Qorvo announced eight PAs that are drop-ins for similar ANADIGICS amplifiers. The PAs provide either 24 or 27 dBm linear output and -47 dBc ACLR. Qorvo also announced a 15 W GaN on SiC, wideband, input-matched transistor that completed stringent environmental testing, demonstrating its reliability for use in defense and emergency response communications equipment. The QPD1000 GaN transistor is offered in a low cost, space-saving, surface-mount plastic DFN package and operates across 30 to 1215 MHz providing wideband gain, power and efficiency. Finally, Qorvo introduced three GaN power amplifiers optimized for military radar, communications and electronic warfare systems: the TGM2635-CP, an X-Band, 100 W MMIC amplifier for satellite communications, data links and radar; the TGA2307-SM, a C-Band, 50 W MMIC amplifier in low cost plastic for radar; and TGA2963, a 20 W MMIC amplifier for wideband communication platforms, radar systems, electronic warfare and test instrumentation. Lots of GaN at Qorvo!

Skyworks released products for small cells and the IoT. For FDD and TDD small cell base stations, the SKY66184-11, SKY66185-11 and SKY66186-11 cover 728 to 768, 850 to 900 and 2100 to 2200 MHz, respectively, with 1 W output and gain greater than 36 dB. Operating from a single, 3.3 V supply, the minimal number of external components and an integrated coupler for output power monitoring makes these devices easy to use. Skyworks also featured two Bluetooth low energy (BLE) front-end modules (FEM) for home, wearable and industrial applications. The FEMs require only 10 mA when transmitting, making them compatible with products operating from coin cell batteries. They more than double the range compared to stand-alone system on chip (SoC) solution. In the booth, Skyworks demonstrated Iotera's IOTA® GPS-enabled tracker that uses Skyworks' SE2435L front-end module, integrating a power amplifier, low noise amplifier and antenna switching with transmit/receive diversity. Other applications for the SE2435L include smart meters, home appliances and smart thermostats.

Materials/PCBs

Rogers was featuring RO4835™ LoPro® Laminates, 92ML™ Materials, TC Series™ Laminates, RT/duroid® 6035HTC Laminates and the RF Energy Alliance. RO4835™ laminates, with a dielectric loss tangent of 0.0037 at 10 GHz, are now available with Rogers proprietary LoPro® reverse treat copper foil. These materials are ideal for applications requiring low insertion loss characteristics. 92ML™ thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. 92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. TC Series™ laminates are designed for applications where high power RF signal demands improved PCB thermal management. RT/duroid® 6035HTC laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability, makes them an exceptional choice for high power applications.

Cables/Connectors

Gore has continuously expanded the company’s microwave/RF solutions at higher frequencies by designing cable assemblies that are reliable and will perform over time, and is now addressing industry requirements for enhanced performance in the 60-70 GHz range.  At the 60-70 GHz range, there is increased need to maintain measurement accuracy, especially in network analyzers, oscilloscopes, analog signal generators, communication testing, chamber testing, and mm-Wave to name a few key applications.  To address these challenges, Gore has developed a new 70 GHz VNA cable assembly; prototypes are currently available for evaluation. They also introduced an online tool designed to complement the existing GORE™ Microwave/RF Assembly Builder.  The new GORE™ Microwave/RF Assembly Calculator is used to calculate insertion loss, VSWR and other parameters of GORE® Microwave/RF Assemblies for different cable types. The Calculator is particularly useful when the initial cable type is unknown and needs to be specified independent of the connector.