Cirexx International announced that they will be presenting their ECLIPS technology at IMS2015 in Phoenix, Ariz., May 17-22. Cirexx will be in Booth # 2023. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave printed circuit boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.
This technology is an alternative to co-fired ceramics and hybrid integrated circuits. The item is essentially a common Printed Circuit Board, made from otherwise typical Printed Circuit Board materials and processes. But with the high thermal conductivity and very low CTE the user can direct attach bare die such as GaN and GaAs. The other electronic components on the board can be standard “plastic parts” attached in a standard process such as a vapor phase soldering. This results in an electronic board system that is smaller, lighter weight, and certainly much less costly than the ceramic hybrid, all-die alternative.
At the booth to discuss the technology and its potential applications will be Al Wasserzug, Cirexx ECLIPS product manager, and Don Kaufman, director of sales & marketing. They will have examples of ECLIPS PCBs and HPA modules as well technical data sheets for visitors. More information is available on the Cirexx website, www.cirexx.com. Looking forward to the conference Kaufman said, “We see IMS as the premier annual event for reaching the largest number of relevant RF/microwave people with a new and enabling technology like ECLIPS.”