Indium Corp.’s Eric Bastow, assistant technical manager, will present at IPC APEX EXPO 2015 on Feb. 24 in San Diego, Calif.

Bastow’s presentation, "Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?", explores the electrical reliability of two no-clean solder pastes stored under various conditions and aged over different time intervals.

No-clean solder paste technology is an attractive product in a competitive world. In this environment, every penny of assembly cost affects profitability. Therefore, it is important to implement a cost-effective process that renders the solder paste flux residue as benign and inert as possible to ensure electrical reliability. Bastow’s presentation explores these issues. Additionally, he will reveal the results and any possible differences detected in SIR performances.

Bastow provides technical support for Indium Corp.s full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets. He is a certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH. Bastow is a certified IPC-A-600 and 610D specialist.

The IPC APEX Expo hosts thousands of colleagues from more than 50 countries at the industry’s premier event and features advanced and emerging technologies in printed board design and manufacturing, electronics assembly, test, and printed electronics.

For more information about Indium Corp., visit www.indium.com or email abrown@indium.com.